Footprints
31 footprints matching “quad”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TQFP-44_10x10mm_P0.8mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)
- Pads
- 44
- SMD
- 13.3×13.3
- Boards
- 335
LQFP-144_20x20mm_P0.5mm
Package_QFP
LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)
- Pads
- 144
- SMD
- 23.3×23.3
- Boards
- 104
SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm
Package_DFN_QFN
20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf
- Pads
- 21
- SMD
- 4.5×4.5
- Boards
- 18
LQFP-128_14x14mm_P0.4mm
Package_QFP
LQFP, 128 Pin (JEDEC MS-026 variation BEE, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=423)
- Pads
- 128
- SMD
- 17.3×17.3
- Boards
- 9
Allegro_QFN-12-10-1EP_3x3mm_P0.5mm
Sensor_Current
Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat Pack, 3x3mm Body, 0.5mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx)
- Pads
- 10
- SMD
- 4.2×4.3
- Boards
- 9
SIMCom_SIM800C
RF_GSM
Quad-Band GSM/GPRS module, 17.6x15.7x2.3mm, http://simcom.ee/documents/SIM800C/SIM800C_Hardware_Design_V1.05.pdf
- Pads
- 42
- SMD
- 18.2×20.1
- Boards
- 8
ST_UFQFPN-20_3x3mm_P0.5mm
Package_DFN_QFN
UFQFPN 20-lead, 3 x 3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package (http://www.st.com/resource/en/datasheet/stm8s003f3.pdf)
- Pads
- 20
- SMD
- 3.5×3.5
- Boards
- 6
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- 3
DFN-14-1EP_3x4.5mm_P0.65mm_EP1.65x4.25mm
Package_DFN_QFN
14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf)
- Pads
- 15
- SMD
- 4.4×5.0
- Boards
- 2
Microsemi_QFN-40-32-2EP_6x8mm_P0.5mm
Package_DFN_QFN
40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package - 6x8x0.9mm Body (https://www.microsemi.com/document-portal/doc_download/131677-pd70224-data-sheet)
- Pads
- 34
- SMD
- 6.9×8.9
- Boards
- 2
QFN-64-1EP_9x9mm_P0.5mm_EP7.35x7.35mm
Package_DFN_QFN
64-Lead Plastic Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 65
- SMD
- 10.3×10.3
- Boards
- 2
UQFN-16-1EP_3x3mm_P0.5mm_EP1.75x1.75mm
Package_DFN_QFN
16-Lead Ultra Thin Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 2
RJ45_Amphenol_RJHSE538X-04
Connector_RJ
Shielded, LEDs, 4 Ports, https://cdn.amphenol-cs.com/media/wysiwyg/files/drawing/rjhse538x04.pdf
- Pads
- 49
- THT
- 67.1×17.9
- Boards
- 1
SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm_ThermalVias
Package_DFN_QFN
20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf
- Pads
- 21
- SMD
- 4.5×4.5
- Boards
- 1
TQFP-144_16x16mm_P0.4mm
Package_QFP
144-Lead Plastic Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 144
- SMD
- 19.4×19.4
- Boards
- 1
SIMCom_SIM900
RF_GSM
Quad-Band GSM/GPRS module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf
- Pads
- 68
- SMD
- 26.1×26.1
- Boards
- 1
L_CommonMode_TDK_B82767S4123N030
Inductor_THT
12A, 3Phase N, Quadruple Coil, https://www.tdk-electronics.tdk.com/inf/30/ds/b82767s4.pdf
- Pads
- 8
- THT
- 62.0×62.0
- Boards
- —
L_CommonMode_TDK_B82767S4193N030
Inductor_THT
19A, 3Phase N, Quadruple Coil, https://www.tdk-electronics.tdk.com/inf/30/ds/b82767s4.pdf
- Pads
- 8
- THT
- 62.0×62.0
- Boards
- —
L_CommonMode_TDK_B82767S4263N030
Inductor_THT
26A , 3Phase N, Quadruple Coil, https://www.tdk-electronics.tdk.com/inf/30/ds/b82767s4.pdf
- Pads
- 8
- THT
- 62.0×62.0
- Boards
- —
L_CommonMode_VAC_T60405-S6123-X402
Inductor_THT
30A, 3Phase N, Quadruple Coil, CM Choke, https://vacuumschmelze.com/03_Documents/Datasheets%20-%20Drawings/Commom-Mode-Chokes/6123-X402.pdf
- Pads
- 8
- THT
- 62.0×62.0
- Boards
- —
TQFP-32_7x7mm_P0.8mm
jlcpcb-JLCPCB
32-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 32
- SMD
- 10.6×10.6
- Boards
- —
Texas_RWU-VQFN-N7_2.1x2.1mm
kiml-00-kiml-dfn-qfn
PLASTIC QUAD FLAT PACK - NO LEAD
- Pads
- 7
- SMD
- 2.6×2.4
- Boards
- —
DFN-14-1EP_3x4.5mm_P0.65mm_EP1.65x4.25mm_ThermalVias
Package_DFN_QFN
14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf)
- Pads
- 15
- SMD
- 4.4×5.0
- Boards
- —
Microchip_8E-16
Package_DFN_QFN
16-Lead Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 17
- SMD
- 5.0×5.0
- Boards
- —