Footprints
857 footprints matching “x4”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOIC-8_3.9x4.9mm_P1.27mm
Package_SO
SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf)
- Pads
- 8
- SMD
- 7.4×5.4
- Boards
- 3,516
SO-8_3.9x4.9mm_P1.27mm
Package_SO
SO, 8 Pin (https://www.nxp.com/docs/en/data-sheet/PCF8523.pdf)
- Pads
- 8
- SMD
- 7.4×5.4
- Boards
- 380
QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
Package_DFN_QFN
QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)
- Pads
- 25
- SMD
- 5.2×5.2
- Boards
- 256
InvenSense_QFN-24_4x4mm_P0.5mm
Sensor_Motion
24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)
- Pads
- 24
- SMD
- 5.3×5.3
- Boards
- 136
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 135
LGA-14_3x2.5mm_P0.5mm_LayoutBorder3x4y
Package_LGA
LGA, 14 Pin (https://www.st.com/resource/en/datasheet/lsm6ds3tr-c.pdf)
- Pads
- 14
- SMD
- 3.5×3.0
- Boards
- 118
QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- 115
SSOP-16_3.9x4.9mm_P0.635mm
Package_SO
SSOP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT519-1.pdf#page=2)
- Pads
- 16
- SMD
- 7.4×5.4
- Boards
- 98
R_LDR_5.1x4.3mm_P3.4mm_Vertical
OptoDevice
Resistor, LDR 5.1x3.4mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf
- Pads
- 2
- THT
- 5.7×4.7
- Boards
- 92
WSON-8-1EP_6x5mm_P1.27mm_EP3.4x4.3mm
Package_SON
WSON, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf (page 68))
- Pads
- 9
- SMD
- 6.7×5.5
- Boards
- 68
TestPoint_Pad_4.0x4.0mm
TestPoint
SMD rectangular pad as test Point, square 4.0mm side length
- Pads
- 1
- SMD
- 5.0×5.0
- Boards
- 67
SW_DIP_SPSTx01_Slide_9.78x4.72mm_W7.62mm_P2.54mm
Button_Switch_THT
1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 9.78x4.72mm (see e.g. https://www.ctscorp.com/wp-content/uploads/206-208.pdf)
- Pads
- 2
- THT
- 10.3×5.3
- Boards
- 61
PinHeader_1x40_P2.54mm_Vertical
Connector_PinHeader_2.54mm
Through hole straight pin header, 1x40, 2.54mm pitch, single row
- Pads
- 40
- THT
- 3.5×102.6
- Boards
- 50
Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias
Package_SO
8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf
- Pads
- 9
- SMD
- 8.4×5.5
- Boards
- 47
QSOP-16_3.9x4.9mm_P0.635mm
Package_SO
QSOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 16
- SMD
- 7.4×5.4
- Boards
- 45
SOP-8_3.76x4.96mm_P1.27mm
Package_SO
SOP, 8 Pin (https://ww2.minicircuits.com/case_style/XX211.pdf)
- Pads
- 8
- SMD
- 7.6×5.5
- Boards
- 44
QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm
Package_DFN_QFN
QFN, 24 Pin (https://www.alldatasheet.com/datasheet-pdf/pdf/1159021/ALFA/AS3330.html)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 41
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm_ThermalVias
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 40
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm_ThermalVias
Package_SO
SOIC, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 38
WSON-8-1EP_6x5mm_P1.27mm_EP3.4x4mm
Package_SON
WSON, 8 Pin (http://ww1.microchip.com/downloads/en/AppNotes/S72030.pdf)
- Pads
- 9
- SMD
- 6.6×5.5
- Boards
- 38
CP_Elec_4x4.5
Capacitor_SMD
SMD capacitor, aluminum electrolytic, Nichicon, 4.0x4.5mm
- Pads
- 2
- SMD
- 6.7×4.8
- Boards
- 34
R_LDR_5.0x4.1mm_P3mm_Vertical
OptoDevice
Resistor, LDR 5x4.1mm, see http://cdn-reichelt.de/documents/datenblatt/A500/A90xxxx%23PE.pdf
- Pads
- 2
- THT
- 5.4×4.6
- Boards
- 34
SOP-4_3.8x4.1mm_P2.54mm
Package_SO
SOP, 4 Pin (https://www.littelfuse.com/assetdocs/littelfuse-integrated-circuits-cpc1017n-datasheet?assetguid=b4f177f1-629f-4104-97a5-8b8d709e83de)
- Pads
- 4
- SMD
- 7.5×4.6
- Boards
- 34
Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias
Package_SO
Texas Instruments HSOP 9, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf)
- Pads
- 9
- SMD
- 7.5×5.5
- Boards
- 34