Components

8,958 components matching “3”

A component is a schematic symbol with, where the catalog has them, its footprint and 3D package model — linked by KiCad's own references and cross-checked pin by pin.

8,958 components · page 356 of 374

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MSP430G2544IRHA40

SYMFP—

MCU_Texas_MSP430

16kB + 256B Flash, 512B RAM, QFN-40

Pins
40
Pads
41
SMD
7.3×7.3

MSP430G2744IRHA40

SYMFP—

MCU_Texas_MSP430

32kB + 256B Flash, 1kB RAM, QFN-40

Pins
40
Pads
41
SMD
7.3×7.3

MSP430G2755IRHA40

SYMFP—

MCU_Texas_MSP430

32kB Flash, 4kB RAM, QFN-40

Pins
40
Pads
41
SMD
7.3×7.3

MSP430G2855IRHA40

SYMFP—

MCU_Texas_MSP430

48kB Flash, 4kB RAM, QFN-40

Pins
40
Pads
41
SMD
7.3×7.3

MSP430G2955IRHA40

SYMFP—

MCU_Texas_MSP430

56kB Flash, 4kB RAM, QFN-40

Pins
40
Pads
41
SMD
7.3×7.3

CC1312R1F3RGZ

SYMFP—

MCU_Texas_SimpleLink

ARM Cortex-M4 SimpleLink High-Performance Sub-1GHz Wireless MCU, 48MHz, 352KB Flash, 80KB SRAM, 8KB Cache SRAM, 1.8-3.6V, 30 GPIO, VQFN-48

Pins
49
Pads
49
SMD
8.3×8.3

T32CZ20B20GQ40

SYMFP—

MCU_Trident

ARM,M33,SubGHz Radio,+20dBm,1MB,Flash,288KRAM,Z-Wave,QFN-40

Pins
41
Pads
41
SMD
6.3×6.3

CH32V003AxMx

SYMFP—

MCU_WCH_RiscV

CH32V003 series are industrial-grade general-purpose microcontrollers designed based on 32-bit RISC-V instruction set and architecture. It adopts QingKe V2A core, RV32EC instruction set, and supports 2 levels of interrupt nesting. The series are mounted with rich peripheral interfaces and function modules. Its internal organizational structure meets the low-cost and low-power embedded application scenarios.

Pins
16
Pads
16
SMD
7.4×10.4

CH32V003FxUx

SYMFP—

MCU_WCH_RiscV

CH32V003 series are industrial-grade general-purpose microcontrollers designed based on 32-bit RISC-V instruction set and architecture. It adopts QingKe V2A core, RV32EC instruction set, and supports 2 levels of interrupt nesting. The series are mounted with rich peripheral interfaces and function modules. Its internal organizational structure meets the low-cost and low-power embedded application scenarios.

Pins
21
Pads
21
SMD
4.3×4.3

CH32V203GxUx

SYMFP—

MCU_WCH_RiscV

NanjingQinheng WCH RISC-V MCU, 32-64KB flash, 10-20KB RAM, 144 MHz, 2.4-3.6V, 24 GPIO, ADC, OpAmp, CAN, USB, WQFN-28

Pins
29
Pads
29
SMD
5.3×5.3

CH32V30xWxUx

SYMFP—

MCU_WCH_RiscV

The CH32V303/5/7 is an connectivity MCUs based on 32-bit RISC-V core.

Pins
69
Pads
69
SMD
9.2×9.2

CH32X035G8U6

SYMFP—

MCU_WCH_RiscV

48MHz RISC-V MCU with USB PD phy (Sink, Source, DRP), USB 2.0 Full speed phy (Host, Device), 20KB RAM, 62KB Flash, WQFN-28

Pins
29
Pads
29
SMD
5.3×5.3

DS2431P

SYMFP—

Memory_EEPROM

1024-bit, 1-Wire® EEPROM chip, TSOC-6

Pins
6
Pads
6
SMD
4.9×4.4

DS2431Q

SYMFP—

Memory_EEPROM

1024-bit, 1-Wire® EEPROM chip, TDFN

Pins
7
Pads
7
SMD
4.3×3.5

MX25R3235FZNxx0

SYMFP—

Memory_Flash

32-Mbit, Wide Range Voltage SPI Serial Flash Memory, WSON-8

Pins
9
Pads
9
SMD
6.6×5.5

AS7C31024B-xxJ

SYMFP—

Memory_RAM

3.3V 1-Mbit (128K X 8-bit) CMOS SRAM, 10/12/15/20ns, SOJ-32 (400 mil)

Pins
32
Pads
32
SMD
12.6×21.5

AS7C31024B-xxTJ

SYMFP—

Memory_RAM

3.3V 1-Mbit (128K X 8-bit) CMOS SRAM, 10/12/15/20ns, SOJ-32 (300 mil)

Pins
32
Pads
32
SMD
9.8×21.5

CY62128EV30xx-xxS

SYMFP—

Memory_RAM

1-Mbit (128K x 8-bit) Static RAM, VCC = 2.2..3.6V, 45ns, SOIC-32 (SOP-32)

Pins
32
Pads
32
SMD
15.7×21.0

IS43LQ32256AL-062BLI

SYMFP—

Memory_RAM

256Mx32 bit Low Power Double Data Rate 4X (LPDDR4X) SDRAM, 1600 MHz, Industrial, BGA-200

Pins
200
Pads
200
SMD
12.0×16.5

MT41K256M16HA

SYMFP—

Memory_RAM

32M x 16-bit x 8 Banks (4-Gbit / 512 MB) DDR3L SDRAM, 1.35V nominal supply voltage, Rev. E, FBGA-96 (9x14mm)

Pins
96
Pads
96
SMD
11.0×16.0

MT41K256M16LY

SYMFP—

Memory_RAM

32M x 16-bit x 8 Banks (4-Gbit / 512 MB) DDR3L SDRAM, 1.35V nominal supply voltage, Rev. N, FBGA-96 (7.5x13.5mm)

Pins
96
Pads
96
SMD
9.5×15.5

MT41K256M16TW

SYMFP—

Memory_RAM

32M x 16-bit x 8 Banks (4-Gbit / 512 MB) DDR3L SDRAM, 1.35V nominal supply voltage, Rev. P, FBGA-96 (8x14mm)

Pins
96
Pads
96
SMD
10.0×16.0

SP335

SYMFP—

muratovas-MAS_IC_Interface

RS-232/RS-485/RS-422 TRANSCEIVER WITH INTERNAL TERMINATION

Pins
33
Pads
33
SMD
6.2×6.2

TPS2378DDA

SYMFP—

muratovas-MAS_IC_Interface

IEEE 802.3at PoE High-Power PD Interface

Pins
9
Pads
9
SMD
7.4×5.4