Components
1,985 components matching “bit”
A component is a schematic symbol with, where the catalog has them, its footprint and 3D package model — linked by KiCad's own references and cross-checked pin by pin.
MSP430F5217IYFF
MCU_Texas_MSP430
64kB Flash, 8kB RAM, BGA-64
- Pins
- 64
- Pads
- 64
- SMD
- 5.4×5.5
MSP430F5219IYFF
MCU_Texas_MSP430
128kB Flash, 8kB RAM, BGA-64
- Pins
- 64
- Pads
- 64
- SMD
- 5.4×5.5
MSP430F5227IYFF
MCU_Texas_MSP430
64kB Flash, 8kB RAM, BGA-64
- Pins
- 64
- Pads
- 64
- SMD
- 5.4×5.5
MSP430F5229IYFF
MCU_Texas_MSP430
128kB Flash, 8kB RAM, BGA-64
- Pins
- 64
- Pads
- 64
- SMD
- 5.4×5.5
MSP430F5526IYFF
MCU_Texas_MSP430
96kB Flash, 6kB + 2kB RAM, BGA-64
- Pins
- 64
- Pads
- 64
- SMD
- 5.4×5.5
MSP430F5528IYFF
MCU_Texas_MSP430
128kB Flash, 8kB + 2kB RAM, BGA-64
- Pins
- 64
- Pads
- 64
- SMD
- 5.4×5.5
MSP430G2444IRHA40
MCU_Texas_MSP430
8kB + 256B Flash, 512B RAM, QFN-40
- Pins
- 40
- Pads
- 41
- SMD
- 7.3×7.3
MSP430G2544IRHA40
MCU_Texas_MSP430
16kB + 256B Flash, 512B RAM, QFN-40
- Pins
- 40
- Pads
- 41
- SMD
- 7.3×7.3
MSP430G2744IRHA40
MCU_Texas_MSP430
32kB + 256B Flash, 1kB RAM, QFN-40
- Pins
- 40
- Pads
- 41
- SMD
- 7.3×7.3
MSP430G2755IRHA40
MCU_Texas_MSP430
32kB Flash, 4kB RAM, QFN-40
- Pins
- 40
- Pads
- 41
- SMD
- 7.3×7.3
MSP430G2855IRHA40
MCU_Texas_MSP430
48kB Flash, 4kB RAM, QFN-40
- Pins
- 40
- Pads
- 41
- SMD
- 7.3×7.3
MSP430G2955IRHA40
MCU_Texas_MSP430
56kB Flash, 4kB RAM, QFN-40
- Pins
- 40
- Pads
- 41
- SMD
- 7.3×7.3
CC1312R1F3RGZ
MCU_Texas_SimpleLink
ARM Cortex-M4 SimpleLink High-Performance Sub-1GHz Wireless MCU, 48MHz, 352KB Flash, 80KB SRAM, 8KB Cache SRAM, 1.8-3.6V, 30 GPIO, VQFN-48
- Pins
- 49
- Pads
- 49
- SMD
- 8.3×8.3
CH32V003AxMx
MCU_WCH_RiscV
CH32V003 series are industrial-grade general-purpose microcontrollers designed based on 32-bit RISC-V instruction set and architecture. It adopts QingKe V2A core, RV32EC instruction set, and supports 2 levels of interrupt nesting. The series are mounted with rich peripheral interfaces and function modules. Its internal organizational structure meets the low-cost and low-power embedded application scenarios.
- Pins
- 16
- Pads
- 16
- SMD
- 7.4×10.4
CH32V003FxUx
MCU_WCH_RiscV
CH32V003 series are industrial-grade general-purpose microcontrollers designed based on 32-bit RISC-V instruction set and architecture. It adopts QingKe V2A core, RV32EC instruction set, and supports 2 levels of interrupt nesting. The series are mounted with rich peripheral interfaces and function modules. Its internal organizational structure meets the low-cost and low-power embedded application scenarios.
- Pins
- 21
- Pads
- 21
- SMD
- 4.3×4.3
CH32V30xWxUx
MCU_WCH_RiscV
The CH32V303/5/7 is an connectivity MCUs based on 32-bit RISC-V core.
- Pins
- 69
- Pads
- 69
- SMD
- 9.2×9.2
CH592F
MCU_WCH_RiscV
RISC-V core Bluetooth LE 5.4 MCU, USB 2.0 host / device, segment LCD driver, SPI, I2C / SMBus, 4 UART, 12-bit ADC, touch-key detection module, WQFN-28
- Pins
- 29
- Pads
- 29
- SMD
- 5.3×5.3
24C02Cx-x-MNY
Memory_EEPROM
2-Kbit (256 x 8-bit) I2C Serial EEPROM, chip address inputs (A0, A1, A2), write-protect pin (WP), 4.5..5.5V supply, WDFN-8 (WSON-8, Microchip's 8-Lead TDFN)
- Pins
- 9
- Pads
- 9
- SMD
- 4.3×2.5
DS2431P
Memory_EEPROM
1024-bit, 1-Wire® EEPROM chip, TSOC-6
- Pins
- 6
- Pads
- 6
- SMD
- 4.9×4.4
DS2431Q
Memory_EEPROM
1024-bit, 1-Wire® EEPROM chip, TDFN
- Pins
- 7
- Pads
- 7
- SMD
- 4.3×3.5
DS28E07P
Memory_EEPROM
1024-bit, 1-Wire® EEPROM chip, TSOC-6
- Pins
- 6
- Pads
- 6
- SMD
- 4.9×4.4
DS28E07Q
Memory_EEPROM
1024-bit, 1-Wire® EEPROM chip, TDFN
- Pins
- 7
- Pads
- 7
- SMD
- 4.3×3.5
AM29F400BB-90SC
Memory_Flash
4-Mbit (512k x 8-bit / 256k x 16-bit) CMOS 5.0 Volt-only Boot Sector Flash Memory, SOP-44
- Pins
- 44
- Pads
- 44
- SMD
- 17.5×28.7
AM29F400Bx-xxSx
Memory_Flash
4-Mbit (512k x 8-bit / 256k x 16-bit) CMOS 5.0 Volt-only Boot Sector Flash Memory, SOP-44
- Pins
- 44
- Pads
- 44
- SMD
- 17.5×28.7