Components

16 components matching “Pack”

A component is a schematic symbol with, where the catalog has them, its footprint and 3D package model — linked by KiCad's own references and cross-checked pin by pin.

I need

Symbol Footprint 3D model

Parts with a symbol and a footprint.

16 components

Matched by name and keywords. Search by meaning instead

R_Pack04_SIP

SYMFP3D

Device

4 resistor network, parallel topology, SIP package

Pins: 8
Pads: 8
THT: 21.0×3.1

R_Pack04_SIP_Split

SYMFP3D

Device

4 resistor network, parallel topology, SIP package, split

Pins: 8
Pads: 8
THT: 21.0×3.1

R_Pack05_SIP_Split

SYMFP3D

Device

5 resistor network, parallel topology, SIP package, split

Pins: 10
Pads: 10
THT: 26.1×3.1

AP9101CK6

SYMFP3D

Battery_Management

Li+ Battery Protection IC for Single Cell Pack, SOT-23-6

Pins: 6
Pads: 6
SMD: 4.1×3.4

AP9101CK

SYMFP3D

Battery_Management

Li+ Battery Protection IC for Single Cell Pack, SOT-23-5

Pins: 5
Pads: 5
SMD: 4.1×3.4

R_Pack02_SIP_Split

SYMFP3D

Device

2 resistor network, parallel topology, SIP package, split

Pins: 4
Pads: 4
THT: 10.8×3.1

R_Pack03_SIP

SYMFP3D

Device

3 resistor network, parallel topology, SIP package

Pins: 6
Pads: 6
THT: 15.9×3.1

R_Pack03_SIP_Split

SYMFP3D

Device

3 resistor network, parallel topology, SIP package, split

Pins: 6
Pads: 6
THT: 15.9×3.1

R_Pack05_SIP

SYMFP3D

Device

5 resistor network, parallel topology, SIP package

Pins: 10
Pads: 10
THT: 26.1×3.1

R_Pack06_SIP_Split

SYMFP3D

Device

6 resistor network, parallel topology, SIP package, split

Pins: 12
Pads: 12
THT: 31.1×3.1

BQ76200PW

SYMFP3D

Battery_Management

High Voltage Battery Pack Front-End Charge/Discharge High-Side NFET Driver, TSSOP-16

Pins: 16
Pads: 16
SMD: 7.7×5.5

R_Pack02_SIP

SYMFP3D

Device

2 resistor network, parallel topology, SIP package

Pins: 4
Pads: 4
THT: 10.8×3.1

R_Pack06_SIP

SYMFP3D

Device

6 resistor network, parallel topology, SIP package

Pins: 12
Pads: 12
THT: 31.1×3.1

R_Pack07_SIP

SYMFP3D

Device

7 resistor network, parallel topology, SIP package

Pins: 14
Pads: 14
THT: 36.2×3.1

R_Pack07_SIP_Split

SYMFP3D

Device

7 resistor network, parallel topology, SIP package, split

Pins: 14
Pads: 14
THT: 36.2×3.1

Adafruit_Feather_M0_RFM69HCW_Packet_Radio

SYMFP—

MCU_Module

Microcontroller module with SAMD21 Cortex-M0 MCU and RFM69HCW Radio

Pins: 32
Pads: 32
THT: 23.4×51.3