Components

599 components matching “package”

A component is a schematic symbol with, where the catalog has them, its footprint and 3D package model — linked by KiCad's own references and cross-checked pin by pin.

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599 components · page 16 of 25

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DAC8531IDRB

SYMFP—

Analog_DAC

16-bit DAC, Voltage Output, Rail-to-Rail Output, SPI interface, VSON-8 3x3mm package

Pins: 8
Pads: 9
SMD: 4.3×3.5

DAC8550IxDGK

SYMFP—

Analog_DAC

16-bit DAC, Voltage Output, Ultra-Low Glitch, Rail-to-Rail Output, SPI interface, VSON-8 3x3mm package

Pins: 8
Pads: 9
SMD: 4.3×3.5

DAC8551IxDGK

SYMFP—

Analog_DAC

16-bit DAC, Voltage Output, Ultralow-Glitch, Rail-to-Rail Output, SPI interface, VSON-8 3x3mm package

Pins: 8
Pads: 9
SMD: 4.3×3.5

DAC8560IxDGK

SYMFP—

Analog_DAC

16-bit DAC, Voltage Output, Ultra-Low Glitch, Rail-to-Rail Output, 2.5V 2-ppm/°C Internal Reference, SPI interface, VSON-8 3x3mm package

Pins: 8
Pads: 9
SMD: 4.3×3.5

MCP73831-3-MC

SYMFP—

Battery_Management

Single cell, Li-Ion/Li-Po charge management controller, 4.35V, Tri-State Status Output, in DFN-8 package

Pins: 8
Pads: 9
SMD: 4.2×2.5

MCP73831-4-MC

SYMFP—

Battery_Management

Single cell, Li-Ion/Li-Po charge management controller, 4.40V, Tri-State Status Output, in DFN-8 package

Pins: 8
Pads: 9
SMD: 4.2×2.5

MCP73831-5-MC

SYMFP—

Battery_Management

Single cell, Li-Ion/Li-Po charge management controller, 4.50V, Tri-State Status Output, in DFN-8 package

Pins: 8
Pads: 9
SMD: 4.2×2.5

MCP73832-2-MC

SYMFP—

Battery_Management

Single cell, Li-Ion/Li-Po charge management controller, 4.20V, Open-Drain Status Output, in DFN-8 package

Pins: 8
Pads: 9
SMD: 4.2×2.5

MCP73832-3-MC

SYMFP—

Battery_Management

Single cell, Li-Ion/Li-Po charge management controller, 4.35V, Open-Drain Status Output, in DFN-8 package

Pins: 8
Pads: 9
SMD: 4.2×2.5

MCP73832-4-MC

SYMFP—

Battery_Management

Single cell, Li-Ion/Li-Po charge management controller, 4.40V, Open-Drain Status Output, in DFN-8 package

Pins: 8
Pads: 9
SMD: 4.2×2.5

MCP73832-5-MC

SYMFP—

Battery_Management

Single cell, Li-Ion/Li-Po charge management controller, 4.50V, Open-Drain Status Output, in DFN-8 package

Pins: 8
Pads: 9
SMD: 4.2×2.5

XRA1201IL24

SYMFP—

Interface_Expansion

16-bit I/O expander, I2C and SMBus interface, interrupts, w/ optional pull-ups, QFN-24 package

Pins: 25
Pads: 25
SMD: 5.3×5.3

XRA1201PIL24

SYMFP—

Interface_Expansion

16-bit I/O expander, I2C and SMBus interface, interrupts, w/ pull-ups, QFN-24 package

Pins: 25
Pads: 25
SMD: 5.3×5.3

ESP32-PICO-V3

SYMFP—

MCU_Espressif

RF Module, ESP32 SoC, 4MB In-Package flash, Wi-Fi 802.11b/g/n, Bluetooth, BLE, 32-bit, 3.0-3.6V, external antenna, QFN-48

Pins: 49
Pads: 49
SMD: 8.2×8.2

ESP32-PICO-V3-02

SYMFP—

MCU_Espressif

RF Module, ESP32 SoC, 8MB In-Package flash, 2MB In-Package PSRAM, Wi-Fi 802.11b/g/n, Bluetooth, BLE, 32-bit, 3.0-3.6V, external antenna, QFN-48

Pins: 49
Pads: 49
SMD: 8.2×8.2

PIC18F45K80-IML

SYMFP—

MCU_Microchip_PIC18

32K Flash, 3.5K RAM, 1K EEPROM, Microchip PIC18F series enhanced flash microcontroller with ECAN and nanoWatt XLP Technology in QFN-44 package

Pins: 45
Pads: 45
SMD: 9.2×9.2

PIC18F46K80-IML

SYMFP—

MCU_Microchip_PIC18

64K Flash, 3.5K RAM, 1K EEPROM PIC18 Microcontroller ADC PWM CAN SPI I2C USART in QFN44 package

Pins: 45
Pads: 45
SMD: 9.2×9.2

PIC18LF45K80-IML

SYMFP—

MCU_Microchip_PIC18

32K Flash, 3.5K RAM, 1K EEPROM PIC18 Microcontroller ADC PWM CAN SPI I2C USART in QFN44 package

Pins: 45
Pads: 45
SMD: 9.2×9.2

PIC18LF46K80-IML

SYMFP—

MCU_Microchip_PIC18

64K Flash, 3.5K RAM, 1K EEPROM PIC18 Microcontroller ADC PWM CAN SPI I2C USART in QFN44 package

Pins: 45
Pads: 45
SMD: 9.2×9.2

AP2204MP-ADJ

SYMFP—

Regulator_Linear

150mA low dropout adjustable linear regulator, wide input voltage range, PSOP-8 package

Pins: 9
Pads: 9
SMD: 7.4×5.4

LM5175RHF

SYMFP—

Regulator_Switching

42-V wide Vin synchronous 4-switch Buck-Boost controller, QFN-28 package

Pins: 29
Pads: 29
SMD: 5.3×6.3

LM5176RHF

SYMFP—

Regulator_Switching

55-V wide Vin synchronous 4-switch Buck-Boost controller, QFN-28 package

Pins: 29
Pads: 29
SMD: 5.3×6.3

M95

SYMFP—

RF_GSM

Quectel quad-band GSM/GPRS module in LCC package

Pins: 42
Pads: 42
SMD: 25.9×29.6

UL865

SYMFP—

RF_GSM

Telit 3G Module (GSM/GPRS/UMTS/HSPA), 3.8V, Digital voice and SMS, I2S, USB 2.0, UART, SPI. Manufacturer package

Pins: 48
Pads: 48
SMD: 30.0×30.0