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Reference layout

Pressure Acquisition System BOARD2

ChicoLiebl-pressure-acquisition-system-board2-pressure-acquisition-system-layout

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ChicoLiebl-pressure-acquisition-system-board2-pressure-acquisition-system-layout

The project archive carries the board, its project file and the upstream licence. The archive is zstd-compressed (tar.zst).

68Placed parts
79Nets
2Copper layers
100 × 40.5 mmBoard size
yesRouted
KiCad 5File format

Bill of materials

68 distinct parts

13 resolve to something in the catalog — click through to the footprint.

RefValueFootprintQty
A1ESP32-WROVER-Icomp-lib:XCVR_ESP32-WROVER-I
C10.1uFdigikey-footprints:0603
C1022uFdigikey-footprints:0805
C111uFdigikey-footprints:0805
C1210uFdigikey-footprints:0805
C130.1uFdigikey-footprints:0603
C141uFdigikey-footprints:0805
C154.7uFdigikey-footprints:0805
C16330pFdigikey-footprints:0603
C170.1uFdigikey-footprints:0603
C1822uFdigikey-footprints:0805
C190.1uFdigikey-footprints:0603
C21uFdigikey-footprints:0805
C201uFdigikey-footprints:0805
C210.1uFdigikey-footprints:0603
C220.1uFdigikey-footprints:0603
C230.1uFdigikey-footprints:0603
C241uFdigikey-footprints:0805
C250.1uFdigikey-footprints:0603
C260.1uFdigikey-footprints:0603
C270.1uFdigikey-footprints:0603
C3220uFCapacitor_THT:CP_Radial_D10.0mm_P2.50mm
C40.1uFCapacitor_THT:C_Rect_L9.0mm_W3.8mm_P7.50mm_MKT
C50.1uFdigikey-footprints:0603
C61uFdigikey-footprints:0805
C747uFdigikey-footprints:1206
C847uFdigikey-footprints:1206
C922uFdigikey-footprints:0805
Cf13.3ndigikey-footprints:0603
D1LED GREENdigikey-footprints:0603
D2LED BLUEdigikey-footprints:0603
D3LED REDdigikey-footprints:0603
F1FuseFuse:Fuse_BelFuse_0ZRE0025FF_L9.6mm_W3.8mm
H1MountingHole_PadMountingHole:MountingHole_2.2mm_M2_DIN965_Pad
J1Conn_01x03comp-lib:AC-Input
J2Conn_Coaxialcomp-lib:BNC_Header
J3USB_B_MicroConnector_USB:USB_Micro-AB_Molex_47590-0001
J4EncoderConnector_PinHeader_1.27mm:PinHeader_1x04_P1.27mm_Vertical
J5Conn_01x10Connector_PinHeader_2.54mm:PinHeader_1x10_P2.54mm_Vertical
L110 mHcomp-lib:UU9.8
Show the other 28
L2220Ω @ 100MHz 2 350mA 300mΩcomp-lib:ACM3225-2P
PS1HLK-PM01Converter_ACDC:Converter_ACDC_HiLink_HLK-PMxx
Q1MMSS8050-H-TPdigikey-footprints:SOT-23-3
Q2MMSS8050-H-TPdigikey-footprints:SOT-23-3
R1560digikey-footprints:0603
R1010kdigikey-footprints:0603
R1133Rdigikey-footprints:0603
R12Rdigikey-footprints:0603
R13Rdigikey-footprints:0603
R2560digikey-footprints:0603
R3560digikey-footprints:0603
R42kdigikey-footprints:0603
R510kdigikey-footprints:0603
R622kdigikey-footprints:0603
R710kdigikey-footprints:0603
R810kdigikey-footprints:0603
R947kdigikey-footprints:0603
RV1VaristorVaristor:RV_Disc_D12mm_W3.9mm_P7.5mm
Ra11kdigikey-footprints:0603
Ra21kdigikey-footprints:0603
Rb1100kdigikey-footprints:0603
Rb2100kdigikey-footprints:0603
Rf112Mdigikey-footprints:0603
U1AMS1117-3.3Package_TO_SOT_SMD:SOT-223-3_TabPin2
U2ADS8689IPWPackage_SO:TSSOP-16_4.4x5mm_P0.65mm
U3CP2102N-A01-GQFN24Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
U4AD8606ACBZ-REEL7Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
U5TMUX1102DPackage_TO_SOT_SMD:SOT-23-5_HandSoldering

Provenance

Commit
unknown
Licence
CC-BY-4.0

How it is used

Trace's agent reads this design as context — what parts a board like this carries, how they are grouped across sheets, what a plausible layer stack and board size look like for the job. It is not copied. The licence above is permissive, and it, the repository and the commit are recorded so the origin of anything derived from it is always answerable.