Reference layout

ABSIS RS485 BUS MASTER

Exprezz0-F-18C_Simulator-board5-F-18C_Simulator-layout

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Exprezz0-F-18C_Simulator-board5-F-18C_Simulator-layout

The project archive carries the board, its project file and the upstream licence. The archive is zstd-compressed (tar.zst).

19Placed parts
26Nets
2Copper layers
90.81 × 53.34 mmBoard size
yesRouted
KiCad 6File format

Bill of materials

19 distinct parts

10 resolve to something in the catalog — click through to the footprint.

RefValueFootprintQty
C10.1uFCapacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder
J1PWR INConnector_Molex:Molex_Mini-Fit_Jr_5566-08A2_2x04_P4.20mm_Vertical
J2BUS #1Connector_Molex:Molex_Mini-Fit_Jr_5566-06A2_2x03_P4.20mm_Vertical
LOGO1OpenHornetLogoSmallKiCAD Libraries:OH_LOGO_37.7mm_5.9mm
LOGO3OpenHornetLogoSmallKiCAD Libraries:CC-BY-NC-SA-Small
LOGO4OpenHornetLogoSmallKiCAD Libraries:OH_LOGO_LARGE
MK1MHSocket_Arduino_Mega:Arduino_1pin
MK3MHSocket_Arduino_Mega:Arduino_1pin
MK4MHSocket_Arduino_Mega:Arduino_1pin
MK6MHSocket_Arduino_Mega:Arduino_1pin
R1120Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder
TP1TP-12TestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm
TP2TP-5VTestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm
TP3TP-3.3VTestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm
TP4TP-GNDTestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm
TP5TP-B1BTestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm
TP6TP-B1ATestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm
U0ProMicroPackage_DIP:DIP-24_W15.24mm_Socket
U1MAX487EESA+TPackage_SO:SOIC-8_3.9x4.9mm_P1.27mm

Provenance

Commit
unknown
Licence
CC-BY-4.0

How it is used

Trace's agent reads this design as context — what parts a board like this carries, how they are grouped across sheets, what a plausible layer stack and board size look like for the job. It is not copied. The licence above is permissive, and it, the repository and the commit are recorded so the origin of anything derived from it is always answerable.