Reference layout

Hardware Simulator BOARD3

HeinVerhallen-Hardware_Simulator-board3-Hardware_Simulator-layout

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HeinVerhallen-Hardware_Simulator-board3-Hardware_Simulator-layout

The project archive carries the board, its project file and the upstream licence. The archive is zstd-compressed (tar.zst).

50Placed parts
29Nets
2Copper layers
56.8 × 86.8 mmBoard size
yesRouted
KiCad 7File format

Bill of materials

50 distinct parts

50 resolve to something in the catalog — click through to the footprint.

RefValueFootprintQty
C11uCapacitor_SMD:C_0805_2012Metric
C10100nCapacitor_SMD:C_0805_2012Metric
C11100nCapacitor_SMD:C_0805_2012Metric
C122u2Capacitor_SMD:C_0805_2012Metric
C131nCapacitor_SMD:C_0805_2012Metric
C142u2Capacitor_SMD:C_0805_2012Metric
C15330nCapacitor_SMD:C_0805_2012Metric
C16100nCapacitor_SMD:C_0805_2012Metric
C1710nCapacitor_SMD:C_0805_2012Metric
C2100nCapacitor_SMD:C_0805_2012Metric
C310uCapacitor_SMD:C_0805_2012Metric
C41uCapacitor_SMD:C_0805_2012Metric
C51nCapacitor_SMD:C_0805_2012Metric
C610uCapacitor_SMD:C_0805_2012Metric
C7100nCapacitor_SMD:C_0805_2012Metric
C8100nCapacitor_SMD:C_0805_2012Metric
C9100nCapacitor_SMD:C_0805_2012Metric
H1MountingHoleMountingHole:MountingHole_3.2mm_M3_DIN965_Pad
H2MountingHoleMountingHole:MountingHole_3.2mm_M3_DIN965_Pad
H3MountingHoleMountingHole:MountingHole_3.2mm_M3_DIN965_Pad
H4MountingHoleMountingHole:MountingHole_3.2mm_M3_DIN965_Pad
HS1Heatsink_Pad_2PinHeatsink:Heatsink_AAVID_573300D00010G_TO-263
HS2Heatsink_Pad_2PinHeatsink:Heatsink_AAVID_573300D00010G_TO-263
J1Conn_01x05Connector_PinHeader_2.54mm:PinHeader_1x05_P2.54mm_Horizontal
J3Cell1_VoutTerminalBlock_Phoenix:TerminalBlock_Phoenix_MKDS-1,5-2-5.08_1x02_P5.08mm_Horizontal
JP1JumperJumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm_NumberLabels
JP2JumperJumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm_NumberLabels
JP3JumperJumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm_NumberLabels
PS1MEE1S1209SCConverter_DCDC:Converter_DCDC_Murata_MEE1SxxxxSC_THT
Q1IRFB7545PBFPackage_TO_SOT_THT:TO-220-3_Horizontal_TabUp
Q2MJE2955TPackage_TO_SOT_THT:TO-220-3_Horizontal_TabUp
Q3MJE2955TPackage_TO_SOT_THT:TO-220-3_Horizontal_TabUp
R1780kResistor_SMD:R_0805_2012Metric
R210kResistor_SMD:R_0805_2012Metric
R30.5mResistor_SMD:R_2512_6332Metric
R447Resistor_SMD:R_0805_2012Metric
R520mResistor_SMD:R_2512_6332Metric
R647Resistor_SMD:R_0805_2012Metric
R720mResistor_SMD:R_2512_6332Metric
R856Resistor_SMD:R_0805_2012Metric
Show the other 10
TP19V_ISOTestPoint:TestPoint_Pad_D2.5mm
TP25V_ISOTestPoint:TestPoint_Pad_D2.5mm
TP3GND_ISOTestPoint:TestPoint_Pad_D2.5mm
TP4GNDTestPoint:TestPoint_Pad_D2.5mm
U1LT3080xQPackage_TO_SOT_SMD:TO-263-5_TabPin3
U2ISO1640BDRPackage_SO:SO-8_3.9x4.9mm_P1.27mm
U3MCP4651T-103E_STPackage_SO:TSSOP-14_4.4x5mm_P0.65mm
U4KA78M05_TO252Package_TO_SOT_SMD:TO-252-2
U5MCP6001UT-I/OTPackage_TO_SOT_SMD:SOT-23-5
U6LT3080xQPackage_TO_SOT_SMD:TO-263-5_TabPin3

Provenance

Commit
unknown
Licence
CC-BY-4.0

How it is used

Trace's agent reads this design as context — what parts a board like this carries, how they are grouped across sheets, what a plausible layer stack and board size look like for the job. It is not copied. The licence above is permissive, and it, the repository and the commit are recorded so the origin of anything derived from it is always answerable.