Reference layout
Noise Reduction Microphone
LeoMH-noise_reduction_microphone-noise_reduction_microphone-layout
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LeoMH-noise_reduction_microphone-noise_reduction_microphone-layout
The project archive carries the board, its project file and the upstream licence. The archive is zstd-compressed (tar.zst).
Bill of materials
52 distinct parts
28 resolve to something in the catalog — click through to the footprint.
| Ref | Value | Footprint | Qty |
|---|---|---|---|
| A1 | RaspberryPi_Pico | Module:RaspberryPi_Pico_SMD_HandSolder | |
| C1 | 10uF | PCM_JLCPCB:C_0603 | |
| C10 | 2.2nF | PCM_JLCPCB:C_0603 | |
| C11 | 2.2nF | PCM_JLCPCB:C_0603 | |
| C12 | 10uF | PCM_JLCPCB:C_0603 | |
| C13 | 100nF | PCM_JLCPCB:C_0603 | |
| C14 | 100nF | PCM_JLCPCB:C_0603 | |
| C15 | 100nF | PCM_JLCPCB:C_0603 | |
| C16 | 100nF | PCM_JLCPCB:C_0603 | |
| C17 | 100nF | PCM_JLCPCB:C_0603 | |
| C2 | 10uF | PCM_JLCPCB:C_0603 | |
| C3 | 10uF | PCM_JLCPCB:C_0603 | |
| C4 | 100nF | PCM_JLCPCB:C_0603 | |
| C5 | 100nF | PCM_JLCPCB:C_0603 | |
| C6 | 100nF | PCM_JLCPCB:C_0603 | |
| C7 | 2.2uF | PCM_JLCPCB:C_0603 | |
| C8 | 2.2uF | PCM_JLCPCB:C_0603 | |
| C9 | 100nF | PCM_JLCPCB:C_0603 | |
| D1 | B0530W | PCM_JLCPCB:D_SOD-123 | |
| H1 | MountingHole | MountingHole:MountingHole_3mm | |
| H2 | MountingHole | MountingHole:MountingHole_3mm | |
| H3 | MountingHole | MountingHole:MountingHole_3mm | |
| H4 | MountingHole | MountingHole:MountingHole_3mm | |
| IC1 | MMICT3902-00-012 | Samacsys:MMICT390200012 | |
| IC2 | MMICT3902-00-012 | Samacsys:MMICT390200012 | |
| IC3 | MMICT3902-00-012 | Samacsys:MMICT390200012 | |
| IC4 | MMICT3902-00-012 | Samacsys:MMICT390200012 | |
| J1 | Power/Audio | Connector_PinHeader_2.54mm:PinHeader_1x05_P2.54mm_Vertical | |
| J2 | Debug Header | Connector_PinHeader_2.54mm:PinHeader_1x07_P2.54mm_Vertical | |
| JP1 | Diode Bypass | Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm | |
| JP2 | MIC4 Select | Jumper:SolderJumper-3_P1.3mm_Open_RoundedPad1.0x1.5mm | |
| JP3 | MIC4 Select | Jumper:SolderJumper-3_P1.3mm_Open_RoundedPad1.0x1.5mm | |
| JP4 | MIC4 Select | Jumper:SolderJumper-3_P1.3mm_Open_RoundedPad1.0x1.5mm | |
| JP5 | MIC4 Select | Jumper:SolderJumper-3_P1.3mm_Open_RoundedPad1.0x1.5mm | |
| R1 | 470Ω | PCM_JLCPCB:R_0603 | |
| R2 | 470Ω | PCM_JLCPCB:R_0603 | |
| TP1 | 5V | TestPoint:TestPoint_Pad_D2.0mm | |
| TP10 | AUDIO_R | TestPoint:TestPoint_Pad_D2.0mm | |
| TP11 | AUDIO_L | TestPoint:TestPoint_Pad_D2.0mm | |
| TP12 | AUDIO_GND | TestPoint:TestPoint_Pad_D2.0mm |
Show the other 12
| TP13 | WS | TestPoint:TestPoint_Pad_D2.0mm | |
| TP14 | DAC_DIN | TestPoint:TestPoint_Pad_D2.0mm | |
| TP15 | BCLK | TestPoint:TestPoint_Pad_D2.0mm | |
| TP2 | 3V | TestPoint:TestPoint_Pad_D2.0mm | |
| TP3 | MIC1_OUT | TestPoint:TestPoint_Pad_D2.0mm | |
| TP4 | MIC2_OUT | TestPoint:TestPoint_Pad_D2.0mm | |
| TP5 | MIC3_OUT | TestPoint:TestPoint_Pad_D2.0mm | |
| TP6 | MIC4_OUT | TestPoint:TestPoint_Pad_D2.0mm | |
| TP7 | CLK1 | TestPoint:TestPoint_Pad_D2.0mm | |
| TP8 | CLK2 | TestPoint:TestPoint_Pad_D2.0mm | |
| TP9 | GND | TestPoint:TestPoint_Pad_D2.0mm | |
| U1 | PCM5101A | Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm |
Provenance
- Repository
- LeoMH/noise_reduction_microphone ↗
- Commit
- unknown
- Licence
- CC-BY-4.0
How it is used
Trace's agent reads this design as context — what parts a board like this carries, how they are grouped across sheets, what a plausible layer stack and board size look like for the job. It is not copied. The licence above is permissive, and it, the repository and the commit are recorded so the origin of anything derived from it is always answerable.