Reference layout
Letsupuri BOARD2
Pekaso-letsupuri-board2-letsupuri-layout
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Pekaso-letsupuri-board2-letsupuri-layout
The project archive carries the board, its project file and the upstream licence. The archive is zstd-compressed (tar.zst).
93Placed parts
74Nets
4Copper layers
114.3 × 76.2 mmBoard size
yesRouted
KiCad 8File format
Bill of materials
93 distinct parts
68 resolve to something in the catalog — click through to the footprint.
Show the other 53
| R1 | 1k | Resistor_SMD:R_0402_1005Metric | |
| R2 | 10k | Resistor_SMD:R_0402_1005Metric | |
| R3 | 22 | Resistor_SMD:R_0402_1005Metric | |
| R4 | 22 | Resistor_SMD:R_0402_1005Metric | |
| R5 | 10k | Resistor_SMD:R_0402_1005Metric | |
| R6 | 1k | Resistor_SMD:R_0402_1005Metric | |
| SW1 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW10 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW11 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW12 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW13 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW14 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW15 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW16 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW17 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW18 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW19 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW2 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW20 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW21 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW22 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW23 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW24 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW3 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW4 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW5 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW6 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW7 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW8 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| SW9 | SW_Push | footprint:SW_Hotswap_Kailh_Choc_V1V2_1.00u | |
| TP1 | GPIO20 | TestPoint:TestPoint_Pad_D1.0mm | |
| TP11 | RESET | TestPoint:TestPoint_Pad_D1.0mm | |
| TP16 | +1.1V_L | TestPoint:TestPoint_Pad_D1.0mm | |
| TP18 | LED_DATA | TestPoint:TestPoint_Pad_D1.0mm | |
| TP19 | ROW0 | TestPoint:TestPoint_Pad_D1.0mm | |
| TP2 | GPIO21 | TestPoint:TestPoint_Pad_D1.0mm | |
| TP20 | ROW1 | TestPoint:TestPoint_Pad_D1.0mm | |
| TP21 | ROW2 | TestPoint:TestPoint_Pad_D1.0mm | |
| TP22 | ROW3 | TestPoint:TestPoint_Pad_D1.0mm | |
| TP23 | COL0 | TestPoint:TestPoint_Pad_D1.0mm | |
| TP24 | COL1 | TestPoint:TestPoint_Pad_D1.0mm | |
| TP25 | COL2 | TestPoint:TestPoint_Pad_D1.0mm | |
| TP26 | COL3 | TestPoint:TestPoint_Pad_D1.0mm | |
| TP27 | COL4 | TestPoint:TestPoint_Pad_D1.0mm | |
| TP28 | COL5 | TestPoint:TestPoint_Pad_D1.0mm | |
| TP3 | GPIO22 | TestPoint:TestPoint_Pad_D1.0mm | |
| TP4 | GPIO23 | TestPoint:TestPoint_Pad_D1.0mm | |
| TP5 | GPIO24 | TestPoint:TestPoint_Pad_D1.0mm | |
| TP8 | SW_CLK | TestPoint:TestPoint_Pad_D1.0mm | |
| TP9 | SWD | TestPoint:TestPoint_Pad_D1.0mm | |
| U1 | W25Q128JVP | Package_SON:Winbond_USON-8-1EP_3x2mm_P0.5mm_EP0.2x1.6mm | |
| U2 | RP2040 | Package_DFN_QFN:QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm | |
| Y1 | 12MHz | Crystal:Crystal_SMD_3225-4Pin_3.2x2.5mm |
Provenance
- Repository
- Pekaso/letsupuri ↗
- Commit
- unknown
- Licence
- CC-BY-4.0
How it is used
Trace's agent reads this design as context — what parts a board like this carries, how they are grouped across sheets, what a plausible layer stack and board size look like for the job. It is not copied. The licence above is permissive, and it, the repository and the commit are recorded so the origin of anything derived from it is always answerable.