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Reference layout

PWM GripHeat

atomspring-PWM-GripHeat-PWM-GripHeat-layout

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atomspring-PWM-GripHeat-PWM-GripHeat-layout

The project archive carries the board, its project file and the upstream licence. The archive is zstd-compressed (tar.zst).

56Placed parts
29Nets
2Copper layers
54.5 × 29.5 mmBoard size
yesRouted
KiCad 8File format

Bill of materials

56 distinct parts

54 resolve to something in the catalog — click through to the footprint.

RefValueFootprintQty
C110uFCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
C1010uFCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
C1110nFCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
C1210uFCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
C1310uFCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
C1410nFCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
C210uFCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
C310uFCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
C410uFCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
C510uFCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
C7EMK325ABJ107MM-TCapacitor_SMD:C_1210_3225Metric_Pad1.33x2.70mm_HandSolder
C810uFCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
C910uFCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
D1BZV55B18Diode_SMD:D_MiniMELF
D10BZV55B5V1Diode_SMD:D_MiniMELF
D11BZV55B5V1Diode_SMD:D_MiniMELF
D2BZV55B18Diode_SMD:D_MiniMELF
D4BZV55B5V1Diode_SMD:D_MiniMELF
D6BZV55B18Diode_SMD:D_MiniMELF
D7BZV55B18Diode_SMD:D_MiniMELF
D8BZV55B5V1Diode_SMD:D_MiniMELF
D9BZV55B5V1Diode_SMD:D_MiniMELF
F1Polyfuse_SmallFuse:Fuse_2920_7451Metric_Pad2.10x5.45mm_HandSolder
G***LOGOAtomspring Logos:10x10mm
J11770885TerminalBlock:TerminalBlock_MaiXu_MX126-5.0-02P_1x02_P5.00mm
J2Screw_Terminal_01x08Connector_PinHeader_2.54mm:PinHeader_2x04_P2.54mm_Vertical
L1330uHmyESP32s:L_Bourns_SRR7045
PS1LMZM23600V5Package_LGA:Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm_ThermalVias
R10100kResistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
R11100kResistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
R12470kResistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
R13470kResistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
R14470kResistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
R151kResistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
R170RResistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
R2100kResistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolder
R3470kResistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
R4100kResistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolder
R5100RResistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
R6100RResistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
Show the other 16
R7100RResistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
R8100RResistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
R91kResistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
TP1+BATTTestPoint:TestPoint_Pad_D1.5mm
TP10GNDTestPoint:TestPoint_THTPad_D2.0mm_Drill1.0mm
TP2+IGNTestPoint:TestPoint_THTPad_D1.0mm_Drill0.5mm
TP3+5VTestPoint:TestPoint_Pad_D1.5mm
TP4SW_INTestPoint:TestPoint_Pad_D1.5mm
TP5REDTestPoint:TestPoint_Pad_D1.5mm
TP6GRNTestPoint:TestPoint_Pad_D1.5mm
TP7BLUETestPoint:TestPoint_Pad_D1.5mm
TP8PWMTestPoint:TestPoint_Pad_D1.5mm
TP9GNDTestPoint:TestPoint_THTPad_D2.0mm_Drill1.0mm
U1ATtiny85-20PPackage_DIP:DIP-8_W7.62mm
U2SiA462DJPackage_TO_SOT_SMD:Vishay_PowerPAK_SC70-6L_Single
U3LM324Package_SO:SOIC-14_3.9x8.7mm_P1.27mm

Provenance

Commit
unknown
Licence
CC-BY-4.0

How it is used

Trace's agent reads this design as context — what parts a board like this carries, how they are grouped across sheets, what a plausible layer stack and board size look like for the job. It is not copied. The licence above is permissive, and it, the repository and the commit are recorded so the origin of anything derived from it is always answerable.