Reference layout
Etl Module Thermal Mockup BOARD2
bu-etl-module_thermal_mockup-board2-module_thermal_mockup-layout
Loading the viewer…
bu-etl-module_thermal_mockup-board2-module_thermal_mockup-layout
The project archive carries the board, its project file and the upstream licence. The archive is zstd-compressed (tar.zst).
Bill of materials
47 distinct parts
41 resolve to something in the catalog — click through to the footprint.
Show the other 7
| U2 | Opamp_Dual | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | |
| U3 | ADS1118 | Package_SO:VSSOP-10_3x3mm_P0.5mm | |
| U4 | Opamp_Dual | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | |
| U5 | LCA701STR | Package_SO:SOIC-6_New | |
| U6 | LCA701STR | Package_SO:SOIC-6_New | |
| U8 | LCA701STR | Package_SO:SOIC-6_New | |
| U9 | LCA701STR | Package_SO:SOIC-6_New |
Provenance
- Repository
- bu-etl/module_thermal_mockup ↗
- Commit
- unknown
- Licence
- CC-BY-4.0
How it is used
Trace's agent reads this design as context — what parts a board like this carries, how they are grouped across sheets, what a plausible layer stack and board size look like for the job. It is not copied. The licence above is permissive, and it, the repository and the commit are recorded so the origin of anything derived from it is always answerable.