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Reference layout

Emi Reflow Oven Hw

cnpem-emi-reflow-oven-hw-reflow-oven-hw-layout

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cnpem-emi-reflow-oven-hw-reflow-oven-hw-layout

The project archive carries the board, its project file and the upstream licence. The archive is zstd-compressed (tar.zst).

28Placed parts
54Nets
2Copper layers
160 × 129.76 mmBoard size
yesRouted
KiCad 6File format

Bill of materials

28 distinct parts

25 resolve to something in the catalog — click through to the footprint.

RefValueFootprintQty
C11uCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
C21uCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
C31uCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
C41uCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
C5100nCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
D2LEDLED_THT:LED_D3.0mm
D3LEDLED_THT:LED_D3.0mm
D4LEDLED_THT:LED_D3.0mm
IC1MBED-LPC1768Mbed_1768:DIPS2286W63P254L5370H300Q40N
J1PotConnector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical
J2Display_Nokia5510Connector_PinHeader_2.54mm:PinHeader_1x08_P2.54mm_Vertical
J3ConnConnector_Phoenix_MSTB:PhoenixContact_MSTBVA_2,5_3-G-5,08_1x03_P5.08mm_Vertical
J4Conn_01x03_MaleConnector_Phoenix_MSTB:PhoenixContact_MSTBVA_2,5_3-G-5,08_1x03_P5.08mm_Vertical
J5Pins-max6675Connector_PinHeader_2.54mm:PinHeader_1x05_P2.54mm_Vertical
PS1XL-007My_component:Converter_ACDC_XL007
R1180Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
R2360Resistor_THT:R_Axial_DIN0411_L9.9mm_D3.6mm_P20.32mm_Horizontal
R3330Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
R469Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
R5250Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
R6250Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
R7250Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
R81kResistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
SW1pb1Button_Switch_THT:SW_Tactile_SKHH_Angled
SW2pb2Button_Switch_THT:SW_Tactile_SKHH_Angled
SW3pb3Button_Switch_THT:SW_Tactile_SKHH_Angled
SW4SW_MEC_5G_2LEDMy_component:P16-BR7-R1
U1MOC3041MPackage_DIP:DIP-6_W7.62mm_Socket_LongPads

Provenance

Commit
unknown
Licence
CC-BY-4.0

How it is used

Trace's agent reads this design as context — what parts a board like this carries, how they are grouped across sheets, what a plausible layer stack and board size look like for the job. It is not copied. The licence above is permissive, and it, the repository and the commit are recorded so the origin of anything derived from it is always answerable.