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Reference layout

Cloud BCIT Project BOARD2

enzexu-cloud-BCIT-project-board2-BCIT-project-layout

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enzexu-cloud-BCIT-project-board2-BCIT-project-layout

The project archive carries the board, its project file and the upstream licence. The archive is zstd-compressed (tar.zst).

81Placed parts
95Nets
2Copper layers
81 × 28.53 mmBoard size
yesRouted
KiCad 9File format

Bill of materials

81 distinct parts

41 resolve to something in the catalog — click through to the footprint.

RefValueFootprintQty
C10.1µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C101µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C111µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C121µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C131µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C140.1µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C150.1µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C1610µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C1710µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C1810µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C190.1µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C20.1µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C200.1µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C211µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C31µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C410µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C51µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C622pFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C722pFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C80.1µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
C90.1µFCapacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder
D2LEDLED_SMD:LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder
D3SM4007Diode_SMD:D_MELF
D4D_SchottkyDiode_SMD:D_SOD-123
J1Battery connectorConnector_JST:JST_EH_S2B-EH_1x02_P2.50mm_Horizontal
J2ThermistorResistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder
J3USB_B_MicroConnector_USB:USB_Micro-B_Molex-105017-0001
J4Solar inConnector_JST:JST_EH_S2B-EH_1x02_P2.50mm_Horizontal
J5main pin header fightConnector_PinSocket_2.54mm:PinSocket_1x21_P2.54mm_Vertical
J6main pin header leftConnector_PinSocket_2.54mm:PinSocket_1x21_P2.54mm_Vertical
JP1CHRG_JumperJumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm
JP3MCU_ENJumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm
JP43v3_MCU_I2CJumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm
L13.3uInductor_SMD:L_Bourns_SRP7028A_7.3x6.6mm
Q12N7002Package_TO_SOT_SMD:SOT-23
Q22N7002Package_TO_SOT_SMD:SOT-23
Q3S8050Package_TO_SOT_SMD:SOT-23_Handsoldering
Q4S8050Package_TO_SOT_SMD:SOT-23_Handsoldering
Q5AO3401APackage_TO_SOT_SMD:SOT-23_Handsoldering
Q6AO3401APackage_TO_SOT_SMD:SOT-23_Handsoldering
Show the other 41
Q72N7002Package_TO_SOT_SMD:SOT-23
R11kResistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder
R101kResistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder
R1110kResistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder
R1210kResistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder
R13180kResistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder
R14180kResistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder
R1522kResistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder
R16180kResistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder
R1722kResistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder
R2100Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder
R21100Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder
R310kResistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder
R51.8kResistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder
R6180kResistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder
R71MResistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder
R810kResistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder
R910kResistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder
TP1TestPointTestPoint:TestPoint_Pad_1.5x1.5mm
TP2TestPointTestPoint:TestPoint_Pad_1.5x1.5mm
TP3TestPointTestPoint:TestPoint_Pad_1.5x1.5mm
TP4TestPointTestPoint:TestPoint_Pad_1.5x1.5mm
TP5TestPointTestPoint:TestPoint_Pad_1.5x1.5mm
TP6TestPointTestPoint:TestPoint_Pad_1.5x1.5mm
TP7TestPointTestPoint:TestPoint_Pad_1.5x1.5mm
TP8TestPointTestPoint:TestPoint_Pad_1.5x1.5mm
U1FS312F-GPackage_TO_SOT_SMD:SOT-23-6_Handsoldering
U10FP6291LRPackage_TO_SOT_SMD:SOT-23-6_Handsoldering
U11ME6210A33PPackage_TO_SOT_SMD:SOT-89-3_Handsoldering
U12ME6210A33PPackage_TO_SOT_SMD:SOT-89-3_Handsoldering
U13ESP32-WROOM32RF_Module:ESP32-WROOM-32
U2FS8205APackage_SO:TSSOP-8_4.4x3mm_P0.65mm
U3LC709203FQHPackage_DFN_QFN:WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm
U4TP4056Package_SO:SOP-8_3.9x4.9mm_P1.27mm
U5CH340GPackage_SO:SOP-16_4.55x10.3mm_P1.27mm
U6AMS1117-3.3Package_TO_SOT_SMD:SOT-223-3_TabPin2
U7PCF8563TPackage_SO:SOIC-8_3.9x4.9mm_P1.27mm
U8XC6206P332MRPackage_TO_SOT_SMD:SOT-23_Handsoldering
U9TCA6408APackage_SO:TSSOP-16_4.4x5mm_P0.65mm
Y112MHZCrystal:Crystal_SMD_3225-4Pin_3.2x2.5mm_HandSoldering
Y232.768KHzCrystal:Crystal_SMD_3215-2Pin_3.2x1.5mm

Provenance

Commit
unknown
Licence
CC-BY-4.0

How it is used

Trace's agent reads this design as context — what parts a board like this carries, how they are grouped across sheets, what a plausible layer stack and board size look like for the job. It is not copied. The licence above is permissive, and it, the repository and the commit are recorded so the origin of anything derived from it is always answerable.