Reference layout

TLE7209-2R Module

rusefi-hw_modular-board3-hw_modular-layout

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rusefi-hw_modular-board3-hw_modular-layout

The project archive carries the board, its project file and the upstream licence. The archive is zstd-compressed (tar.zst).

13Placed parts
13Nets
2Copper layers
43 × 22 mmBoard size
yesRouted
KiCad 5File format

Bill of materials

13 distinct parts

4 resolve to something in the catalog — click through to the footprint.

RefValueFootprintQty
C1100nFCapacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder
C233nFCapacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder
C310nFCapacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder
C4100uFCapacitor_SMD:CP_Elec_8x10
D1TPSMB24ADiode_SMD:D_SMA
J1Conn_02x06_Odd_EvenConnector_PinHeader_2.54mm:PinHeader_2x08_P2.54mm_Vertical
J3Conn_01x01Connector:1pin
R147KResistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder
R21MResistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder
R34.7KResistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder
R410KResistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder
R510KResistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder
U1TLE7209-2RPackage_SO:HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown_ThermalVias

Provenance

Commit
unknown
Licence
CC-BY-4.0

How it is used

Trace's agent reads this design as context — what parts a board like this carries, how they are grouped across sheets, what a plausible layer stack and board size look like for the job. It is not copied. The licence above is permissive, and it, the repository and the commit are recorded so the origin of anything derived from it is always answerable.