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Reference layout

GBAHD Shield

sanchezand-GBAHD-Shield-GBAHD-Shield-layout

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sanchezand-GBAHD-Shield-GBAHD-Shield-layout

The project archive carries the board, its project file and the upstream licence. The archive is zstd-compressed (tar.zst).

70Placed parts
147Nets
2Copper layers
79.53 × 64.42 mmBoard size
yesRouted
KiCad 5File format

Bill of materials

54 distinct parts

20 resolve to something in the catalog — click through to the footprint.

RefValueFootprintQty
C122pFCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
C222pFCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
C3100nFCapacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder
D1LEDLED_THT:LED_D5.0mm_FlatTop
EX1EX1TestPoint:TestPoint_Pad_1.5x1.5mm
EX2EX2TestPoint:TestPoint_Pad_1.5x1.5mm
EX3EX3TestPoint:TestPoint_Pad_1.5x1.5mm
EX4EX4TestPoint:TestPoint_Pad_1.5x1.5mm
EXP1PinHeader_1x08_P2.54mm_VerticalConnector_PinHeader_2.54mm:PinHeader_1x08_P2.54mm_Vertical
EXP2PinHeader_1x06_P2.54mm_VerticalConnector_PinHeader_2.54mm:PinHeader_1x06_P2.54mm_Vertical
G***LOGORaizu_OFFSET:OFFSET_LOGO_4.0mm
GBA1GBA_VCCRaizu_OFFSET:SOLDER_PAD
GBA2GBA_RESETRaizu_OFFSET:SOLDER_PAD
GBA3GBA_CLKRaizu_OFFSET:SOLDER_PAD
GBA4GBA_GNDRaizu_OFFSET:SOLDER_PAD
GEX1GBA_EX1Raizu_OFFSET:SOLDER_PAD
GEX2GBA_EX2Raizu_OFFSET:SOLDER_PAD
GEX3GBA_EX3Raizu_OFFSET:SOLDER_PAD
GEX4GBA_EX4Raizu_OFFSET:SOLDER_PAD
HOLEM3VAL**keyboard_parts:HOLE_M3
J1Conn_01x40Raizu:JUSHUO_AFC01-S40FCC-00
J10Conn_01x02Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical
J11Conn_01x05Connector_PinHeader_2.54mm:PinHeader_1x05_P2.54mm_Vertical
J2Conn_02x08_Top_BottomConnector_PinHeader_2.54mm:PinHeader_2x08_P2.54mm_Vertical
J3Conn_01x20Raizu:JUSHUO_AFC01-S20FCC-00
J4Conn_02x10_Top_BottomConnector_PinHeader_2.54mm:PinHeader_2x10_P2.54mm_Vertical
J5Conn_01x34Raizu:JUSHUO_AFC07-S34FCC-00
J6Conn_02x03_Odd_EvenConnector_PinHeader_2.54mm:PinHeader_2x03_P2.54mm_Vertical
J7Conn_01x32Raizu:JUSHUO_AFC01-S32FCC-00
J8Conn_01x05Connector_PinHeader_2.54mm:PinHeader_1x05_P2.54mm_Vertical
J9Conn_01x20Raizu:JUSHUO_AFC01-S20FCC-00
P1CONN_WIIRaizu_OFFSET:CONN_WII
P2CONN_WIIRaizu_OFFSET:CONN_WII
R110KResistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
R2120Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder
REF**OFFSET_LOGO_SILK_2.6mmRaizu_OFFSET:OFFSET_LOGO_SILK_2.6mm
S1GBA_S01Raizu_OFFSET:SOLDER_PAD
S2GBA_S02Raizu_OFFSET:SOLDER_PAD
SW1SW_PushRaizu_OFFSET:XKB-TS-1185EC-C-D-B
SW2Switch-DPDTRaizu_OFFSET:XKB_XKB5858-Z-C
Show the other 14
TP0GBA_ARaizu_OFFSET:SOLDER_PAD
TP1GBA_BRaizu_OFFSET:SOLDER_PAD
TP19TestPointRaizu_OFFSET:SOLDER_PAD
TP2GBA_SELRaizu_OFFSET:SOLDER_PAD
TP3GBA_STRRaizu_OFFSET:SOLDER_PAD
TP4GBA_DRRaizu_OFFSET:SOLDER_PAD
TP5GBA_DLRaizu_OFFSET:SOLDER_PAD
TP6GBA_DURaizu_OFFSET:SOLDER_PAD
TP7GBA_DDRaizu_OFFSET:SOLDER_PAD
TP8GBA_RRaizu_OFFSET:SOLDER_PAD
TP9GBA_LRaizu_OFFSET:SOLDER_PAD
U2ATmega328P-AUPackage_QFP:TQFP-32_7x7mm_P0.8mm
X1Crystal_GND2Crystal:Crystal_SMD_3225-4Pin_3.2x2.5mm
mousebiteVAL**Panelization:mouse-bite-2.54mm-slot

Provenance

Commit
unknown
Licence
CC-BY-4.0

How it is used

Trace's agent reads this design as context — what parts a board like this carries, how they are grouped across sheets, what a plausible layer stack and board size look like for the job. It is not copied. The licence above is permissive, and it, the repository and the commit are recorded so the origin of anything derived from it is always answerable.