Reference layout

CRPS to ATX

sundr007-ATXserverPSU-ATXserverPSU-layout

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sundr007-ATXserverPSU-ATXserverPSU-layout

The project archive carries the board, its project file and the upstream licence. The archive is zstd-compressed (tar.zst).

79Placed parts
47Nets
2Copper layers
100 × 80.5 mmBoard size
yesRouted
KiCad 5File format

Bill of materials

79 distinct parts

20 resolve to something in the catalog — click through to the footprint.

RefValueFootprintQty
C10330uFCapacitor_THT:C_Radial_D6.3mm_H7.0mm_P2.50mm
C1044.7uFAEvan:0805_C
C105100nFAEvan:0805_C
C106100nFAEvan:0805_C
C1074.7uFAEvan:0805_C
C10847uFCapacitor_Tantalum_SMD:CP_EIA-3528-15_AVX-H
C1094.7uFAEvan:0805_C
C110100nFAEvan:0805_C
C1114.7uFAEvan:0805_C
C113100nFAEvan:0805_C
C114680pFAEvan:0805_C
C1154.7uFAEvan:0805_C
C1164.7uFAEvan:0805_C
C117330uFCapacitor_THT:C_Radial_D6.3mm_H7.0mm_P2.50mm
C118330uFCapacitor_THT:C_Radial_D6.3mm_H7.0mm_P2.50mm
C1300.1uFAEvan:0805_C
C24.7uFAEvan:0805_C
C3100nFAEvan:0805_C
C44.7uFAEvan:0805_C
C5100nFAEvan:0805_C
C6680pFAEvan:0805_C
C74.7uFAEvan:0805_C
C84.7uFAEvan:0805_C
C9330uFCapacitor_THT:C_Radial_D6.3mm_H7.0mm_P2.50mm
HS1Heatsink_PadAEvan:5X6-HEATSINK
HS101Heatsink_PadAEvan:5X6-HEATSINK
HS102Heatsink_PadAEvan:5X6-HEATSINK
HS103Heatsink_PadAEvan:5X6-HEATSINK
HS104Heatsink_PadAEvan:5X6-HEATSINK
HS2Heatsink_PadAEvan:5X6-HEATSINK
HS3Heatsink_PadAEvan:5X6-HEATSINK
HS4Heatsink_PadAEvan:5X6-HEATSINK
J107Conn_02x04_Top_BottomATXs:Molex_Mini-Fit_Jr_5566-08A_2x04_P4.20mm_Vertical
J108Conn_02x04_Top_BottomATXs:Molex_Mini-Fit_Jr_5566-08A_2x04_P4.20mm_Vertical
J109Conn_02x04_Top_BottomATXs:Molex_Mini-Fit_Jr_5566-08A_2x04_P4.20mm_Vertical
J110Conn_02x04_Top_BottomATXs:Molex_Mini-Fit_Jr_5566-08A_2x04_P4.20mm_Vertical
J111Conn_02x04_Top_BottomATXs:Molex_Mini-Fit_Jr_5566-08A_2x04_P4.20mm_Vertical
J112Conn_02x04_Top_BottomATXs:Molex_Mini-Fit_Jr_5566-08A_2x04_P4.20mm_Vertical
J113Conn_02x04_Top_BottomATXs:Molex_Mini-Fit_Jr_5566-08A_2x04_P4.20mm_Vertical
J114Conn_02x03_Top_BottomATXs:Molex_Mini-Fit_Jr_5566-06A_2x03_P4.20mm_Vertical
Show the other 39
J115Conn_02x03_Top_BottomATXs:Molex_Mini-Fit_Jr_5566-06A_2x03_P4.20mm_Vertical
J116Conn_02x03_Top_BottomATXs:Molex_Mini-Fit_Jr_5566-06A_2x03_P4.20mm_Vertical
J117Conn_02x03_Top_BottomATXs:Molex_Mini-Fit_Jr_5566-06A_2x03_P4.20mm_Vertical
J118Conn_02x05_Top_BottomATXs:Molex_Mini-Fit_Jr_5566-10A_2x05_P4.20mm_Vertical
J119Conn_02x09_Top_BottomATXs:Molex_Mini-Fit_Jr_5566-18A_2x09_P4.20mm_Vertical
J200Conn_02x28_Odd_EvenConnector_PinSocket_2.54mm:PinSocket_2x28_P2.54mm_Horizontal
L1LInductor_SMD:L_12x12mm_H8mm
L1014.7uHInductor_SMD:L_6.3x6.3_H3
L102LInductor_SMD:L_12x12mm_H8mm
Q1BSC026N08NS5ATMA1Package_TO_SOT_SMD:TDSON-8-1
Q101BSC026N08NS5ATMA1Package_TO_SOT_SMD:TDSON-8-1
Q102BSC026N08NS5ATMA1Package_TO_SOT_SMD:TDSON-8-1
Q103BSC026N08NS5ATMA1Package_TO_SOT_SMD:TDSON-8-1
Q104BSC026N08NS5ATMA1Package_TO_SOT_SMD:TDSON-8-1
Q1092N7002EPackage_TO_SOT_SMD:SOT-23
Q2BSC026N08NS5ATMA1Package_TO_SOT_SMD:TDSON-8-1
Q3BSC026N08NS5ATMA1Package_TO_SOT_SMD:TDSON-8-1
Q4BSC026N08NS5ATMA1Package_TO_SOT_SMD:TDSON-8-1
R110KAEvan:0805_R
R1010KAEvan:0805_R
R10110KAEvan:0805_R
R10210KAEvan:0805_R
R10354.9KAEvan:0805_R
R10410KAEvan:0805_R
R10610KAEvan:0805_R
R1086.8KAEvan:0805_R
R1095.01AEvan:0805_R
R115.01AEvan:0805_R
R126.8KAEvan:0805_R
R135.01AEvan:0805_R
R210KAEvan:0805_R
R310KAEvan:0805_R
R45.01AEvan:0805_R
R554.68KAEvan:0805_R
R632.7kAEvan:0805_R
U1TPS53015AEvan:VSSOP-10_2.4x2.1mm_Pitch0.5mm
U101TPS56220XPackage_TO_SOT_SMD:SOT-23-6_Handsoldering
U102TPS53015AEvan:VSSOP-10_2.4x2.1mm_Pitch0.5mm
U1047402Package_SO:SOIC-14W_7.5x9mm_P1.27mm

Provenance

Commit
unknown
Licence
CC-BY-4.0

How it is used

Trace's agent reads this design as context — what parts a board like this carries, how they are grouped across sheets, what a plausible layer stack and board size look like for the job. It is not copied. The licence above is permissive, and it, the repository and the commit are recorded so the origin of anything derived from it is always answerable.