Heatsink_AAVID_Extruded_531002B02100G_34.9x12.7mm_H25.4mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐202, TO‐220, 25.4mm height, 2.46mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
Footprint
1 pads
- Mount
- Through hole
- Courtyard
- 36 × 14 mm
- Pads
- 1
- File
- 17 KB
3D model
STEPHeatsink_Heatsink_AAVID_Extruded_531002B02100G_34.9x12.7mm_H25.4mm
34.54 × 12.39 × 29 mm
161 KB STEP
- Library
- Heatsink_Heatsink_AAVID_Extruded_531002B02100G_34.9x12.7mm
- Model page
- Open →
Provenance
- Source
- kicad-footprints
- Credit
- KiCad Libraries Contributors
- Licence
- CC-BY-SA-4.0-with-KiCad-exception