Heatsink_AAVID_Extruded_531102B02500G_34.9x12.7mm_H38.1mm
Heatsink
Extruded 5310, dual radial board level heatsink, TO‐220, 38.1mm height, 2.37mm dia. pins, https://info.boydcorp.com/hubfs/Thermal/Air-Cooling/Boyd-Board-Level-Cooling-Extruded-5310.pdf
Footprint
1 pads
- Mount
- Through hole
- Courtyard
- 36 × 14 mm
- Pads
- 1
- File
- 17 KB
3D model
STEPHeatsink_Heatsink_AAVID_Extruded_531102B02500G_34.9x12.7mm_H38.1mm
34.54 × 12.39 × 42.06 mm
150 KB STEP
- Library
- Heatsink_Heatsink_AAVID_Extruded_531102B02500G_34.9x12.7mm
- Model page
- Open →
Provenance
- Source
- kicad-footprints
- Credit
- KiCad Libraries Contributors
- Licence
- CC-BY-SA-4.0-with-KiCad-exception