Fujitsu_WLP-15_2.28x3.092mm_Layout3x5_P0.4mm

Package_BGA

WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf

Footprint

8 pads

Footprint Fujitsu_WLP-15_2.28x3.092mm_Layout3x5_P0.4mm

Mount: Surface mount
Courtyard: 4.28 × 5.1 mm
Pads: 8
File: 5 KB

3D model

STEP

Package_BGA_Fujitsu_WLP-15_2.28x3.092mm_Layout3x5_P0.4mm

2.28 × 3.09 × 0.26 mm

16 KB STEP

Library: Package_BGA_Fujitsu_WLP-15_2.28x3.092mm_Layout3x5
Model page: Open →

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception