Microchip_FCG1152_BGA-1152_35x35mm_Layout34x34_P1.0mm

Package_BGA

FCG1152, 35.0x35.0mm, 1152 Ball, 34x34 Layout, 1.0mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf

Footprint

1152 pads
Footprint Microchip_FCG1152_BGA-1152_35x35mm_Layout34x34_P1.0mm
Mount
Surface mount
Courtyard
37 × 37 mm
Pads
1152
File
143 KB

3D model

none
no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception