Microchip_FCSG325_BGA-325_11x11mm_Layout21x21_P0.5mm

Package_BGA

FCSG325, 11.0x11.0mm, 325 Ball, 21x21 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf

Footprint

325 pads
Footprint Microchip_FCSG325_BGA-325_11x11mm_Layout21x21_P0.5mm
Mount
Surface mount
Courtyard
13 × 13 mm
Pads
325
File
41 KB

3D model

none
no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception