Microchip_FCSG536_BGA-536_16x16mm_Layout30x30_P0.5mm

Package_BGA

FCSG536, 16.0x16.0mm, 536 Ball, 30x30 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf

Footprint

536 pads
Footprint Microchip_FCSG536_BGA-536_16x16mm_Layout30x30_P0.5mm
Mount
Surface mount
Courtyard
18 × 18 mm
Pads
536
File
68 KB

3D model

none
no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception