Microchip_FCVG784_BGA-784_23x23mm_Layout28x28_P0.8mm
Package_BGA
FCVG784, 23.0x23.0mm, 784 Ball, 28x28 Layout, 0.8mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf
Footprint
784 pads
- Mount
- Surface mount
- Courtyard
- 25 × 25 mm
- Pads
- 784
- File
- 96 KB
3D model
noneno 3D model
This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.
Provenance
- Source
- kicad-footprints
- Credit
- KiCad Libraries Contributors
- Licence
- CC-BY-SA-4.0-with-KiCad-exception