Texas_DSBGA-12_2.11x1.61mm_Layout4x3_P0.5mm

Package_BGA

Texas Instruments, YZG (R-XBGA-N12) package, 0.275 .. 0.475mm body thickness, NSMD, 2.11x1.61mm, 12 Ball, 4x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/tsc2007.pdf#page=34, https://www.ti.com/lit/ml/mxbg028d/mxbg028d.pdf

BGA
12
0.5
UFBGA-12_2.11x1.61mm_Layout4x3_P0.5mm
Die-Size-Ball-Grid-Array

Footprint

12 pads

Mount: Surface mount
Courtyard: 4.12 × 3.62 mm
Pads: 12
File: 4 KB

3D model

STEP

Package_BGA_Texas_DSBGA-12_2.11x1.61mm_Layout4x3_P0.5mm

2.11 × 1.61 × 0.63 mm

20 KB STEP

Library: Package_BGA_Texas_DSBGA-12_2.11x1.61mm_Layout4x3
Model page: Open →

Parts that use it

1 component in the catalog place this footprint

TSC2007xYZG

SYMFP3D

Driver_Display

12-bit, 4-wire touchscreen controller, 1.2 - 3.6V single supply, I2C interface, UFBGA-12 (Texas DSBGA / YZG)

Pins: 12
Pads: 12
SMD: 4.1×3.6

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception