Texas_DSBGA-5_1.5855x1.6365mm_Layout3x2_P0.5mm

Package_BGA

Texas Instruments, DSBGA, area grid, YTA0005 pad definition, 1.5855x1.6365mm, 5 Ball, 3x2 Layout, 0.5mm Pitch, https://www.ti.com/lit/ml/mxbg263/mxbg263.pdf, https://www.ti.com/lit/ds/symlink/lm74.pdf#page=24

Footprint

5 pads

Mount: Surface mount
Courtyard: 3.58 × 3.64 mm
Pads: 5
File: 5 KB

3D model

none

no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Parts that use it

1 component in the catalog place this footprint

LM74CITP

SYMFP—

Sensor_Temperature

12-Bit plus sign digital temperature sensor with SPI/Microwire, DSBGA-5

Pins: 5
Pads: 5
SMD: 3.6×3.6

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception