Texas_DSBGA-6_0.95x1.488mm_Layout2x3_P0.4mm

Package_BGA

Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf

Footprint

6 pads

Mount: Surface mount
Courtyard: 2.96 × 3.5 mm
Pads: 6
File: 3 KB

3D model

none

no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Parts that use it

2 components in the catalog place this footprint

TMP119AIYBGR

SYMFP—

Sensor_Temperature

Ultra-High Accuracy, Low-Power, Digital Temperature Sensor With SMBus and I2C-Compatible Interface, DSBGA-6

Pins: 6
Pads: 6
SMD: 3.0×3.5

TMP117xxYBG

SYMFP—

Sensor_Temperature

Digital Temperature Sensor with I2C/SMBus Interface, 16 bits, ±0.3°C, one-shot conversion, alert, nist traceable, EEPROM, DSBGA

Pins: 6
Pads: 6
SMD: 3.0×3.5

On real boards

The largest boards that carry it

Design	Parts	Nets	Layers	Board	Licence	Source
FOSSerZero	331	203	4	95.43 × 36.15 mm	CC-BY-4.0	E440QF/FOSSerZero ↗
MiniCO2	25	36	4	13.6 × 19.38 mm	CC-BY-4.0	nup002/miniCO2 ↗
Md Classic Display	14	24	2	11.5 × 27.46 mm	CC-BY-4.0	Sir68k/md-classic-display ↗

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception