Texas_DSBGA-8_1.43x1.41mm_Layout3x3_P0.5mm

Package_BGA

Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)

Footprint

8 pads

Mount: Surface mount
Courtyard: 3.42 × 3.44 mm
Pads: 8
File: 6 KB

3D model

none

no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Parts that use it

1 component in the catalog place this footprint

LMC555xTP

SYMFP—

Timer

CMOS Timer, DSBGA-8

Pins: 8
Pads: 8
SMD: 3.4×3.4

On real boards

The largest boards that carry it

Design	Parts	Nets	Layers	Board	Licence	Source
RoboCamp 2021 BOARD4	54	54	2	181.5 × 72 mm	CC-BY-4.0	RoboticsBrno/RoboCamp-2021 ↗
RoboCamp 2023	40	35	2	119 × 39 mm	CC-BY-4.0	RoboticsBrno/RoboCamp-2023 ↗
Usmd	15	7	2	7 × 0 mm	CC-BY-4.0	arthurbenemann/usmd ↗

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception