Texas_MicroStar_Junior_BGA-12_2.0x2.5mm_Layout4x3_P0.5mm

Package_BGA

Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf)

Texas_Junior_BGA-12

Footprint

12 pads

Mount: Surface mount
Courtyard: 4.5 × 4 mm
Pads: 12
File: 6 KB

3D model

STEP

Package_BGA_Texas_MicroStar_Junior_BGA-12_2.0x2.5mm_Layout4x3_P0.5mm

2.50 × 2 × 0.37 mm

20 KB STEP

Library: Package_BGA_Texas_MicroStar_Junior_BGA-12_2.0x2.5mm_Layout4x3
Model page: Open →

Parts that use it

1 component in the catalog place this footprint

TXB0104ZXU

SYMFP3D

Logic_LevelTranslator

4-Bit Bidirectional Voltage-Level Translator, Auto Direction Sensing and ±15-kV ESD Protection, 1.2 - 3.6V APort, 1.65 - 5.5V BPort, Texas_Junior-12

Pins: 12
Pads: 12
SMD: 4.5×4.0

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception