Xilinx_FFG1761

Package_BGA

Virtex-7 BGA, NSMD pad definition Appendix A, 42.5x42.5mm, 1760 Ball, 42x42 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300

BGA
1760
1
FF1761
FFG1761

Footprint

1760 pads

Mount: Surface mount
Courtyard: 44.5 × 44.5 mm
Pads: 1760
File: 218 KB

3D model

none

no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception