Xilinx_RF676

Package_BGA

Kintex-7 BGA, NSMD pad definition Appendix A, 27x27mm, 676 Ball, 26x26 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297

BGA
676
1
RF676

Footprint

676 pads

Mount: Surface mount
Courtyard: 29 × 29 mm
Pads: 676
File: 85 KB

3D model

none

no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception