Xilinx_RF900

Package_BGA

Kintex-7 and Zynq-7000 BGA, NSMD pad definition Appendix A, 31x31mm, 900 Ball, 30x30 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94

Footprint

900 pads
Footprint Xilinx_RF900
Mount
Surface mount
Courtyard
33 × 33 mm
Pads
900
File
112 KB

3D model

none
no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception