LFCSP-16-1EP_3x3mm_P0.5mm_EP1.854x1.854mm

Package_CSP

16-Lead Lead Frame Chip Scale Package, 3x3mm, 0.5mm pitch, 1.854mm thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf)

Footprint

17 pads

Mount: Surface mount
Courtyard: 4.2 × 4.2 mm
Pads: 17
File: 7 KB

3D model

none

no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Parts that use it

5 components in the catalog place this footprint

AD5687BCPZ

SYMFP—

Analog_DAC

Dual, 12-Bit nanoDAC+ with SPI Interface, LFCSP-16

Pins: 17
Pads: 17
SMD: 4.2×4.2

AD5687RBCPZ

SYMFP—

Analog_DAC

Dual, 12-Bit nanoDAC+ with 2 ppm/°C Reference, SPI Interface, LFCSP-16

Pins: 17
Pads: 17
SMD: 4.2×4.2

AD5689BCPZ

SYMFP—

Analog_DAC

Dual, 16-Bit nanoDAC+ with SPI Interface, LFCSP-16

Pins: 17
Pads: 17
SMD: 4.2×4.2

AD5689RxCPZ

SYMFP—

Analog_DAC

Dual, 16-Bit nanoDAC+ with 2 ppm/°C Reference, SPI Interface, LFCSP-16

Pins: 17
Pads: 17
SMD: 4.2×4.2

AD5697RBCPZ

SYMFP—

Analog_DAC

Dual, 12-Bit nanoDAC+ with 2 ppm/°C Reference, I2C Interface, LFCSP-16

Pins: 17
Pads: 17
SMD: 4.2×4.2

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception