Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm

Package_CSP

Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf

Footprint

15 pads

Mount: Surface mount
Courtyard: 4.38 × 3.18 mm
Pads: 15
File: 4 KB

3D model

none

no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Parts that use it

1 component in the catalog place this footprint

PCMF3USB3S

SYMFP—

Power_Protection

Common-mode EMI filter for differential channels with integrated ESD protection

Pins: 15
Pads: 15
SMD: 4.4×3.2

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception