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OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm

Package_CSP

OnSemi ODCSP36 (Case 570CP), 0.27mm pad, 6.13x6.13mm, 36 Ball, 6x6 Layout, 1.0mm Pitch, https://www.onsemi.com/pub/Collateral/570CP.PDF

Footprint

36 pads
Footprint OnSemi_ODCSP36_BGA-36_6.13x6.13mm_Layout6x6_P1.0mm
Mount
Surface mount
Courtyard
8.14 × 8.14 mm
Pads
36
File
7 KB

3D model

none
no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Parts that use it

1 component in the catalog place this footprint

D_SiPM_OnSemi_MicroFJ-60035

SYMFP—

Sensor_Optical

SiPM, OnSemi J-Series 6x6mm with fast output, 35um microcell size, 24.1..24.7Vbr, ODCSP36

Pins
6
Pads
36
SMD
8.1×8.1

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception