Get Trace

OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm

Package_CSP

OnSemi ODCSP8 (Case 570CS), 0.27mm pad, 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF

Footprint

8 pads
Footprint OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm
Mount
Surface mount
Courtyard
5.16 × 5.16 mm
Pads
8
File
4 KB

3D model

none
no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Parts that use it

1 component in the catalog place this footprint

D_SiPM_OnSemi_MicroFJ-300xx

SYMFP—

Sensor_Optical

SiPM, OnSemi J-Series 3x3mm with fast output, 20/35um microcell size, 24.2..24.7Vbr, ODCSP-8

Pins
4
Pads
8
SMD
5.2×5.2

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception