ST_WLCSP-100_4.4x4.38mm_Layout10x10_P0.4mm_Offcenter

Package_CSP

ST WLCSP-100, off-center ball grid, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf

Footprint

100 pads

Mount: Surface mount
Courtyard: 6.4 × 6.38 mm
Pads: 100
File: 15 KB

3D model

none

no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Parts that use it

4 components in the catalog place this footprint

STM32WB55VCYx

SYMFP—

MCU_ST_STM32WB

STMicroelectronics Arm Cortex-M4 MCU, 256KB flash, 128KB RAM, 64 MHz, 1.71-3.6V, 72 GPIO, WLCSP100

Pins: 100
Pads: 100
SMD: 6.4×6.4

STM32WB55VEYx

SYMFP—

MCU_ST_STM32WB

STMicroelectronics Arm Cortex-M4 MCU, 512KB flash, 256KB RAM, 64 MHz, 1.71-3.6V, 72 GPIO, WLCSP100

Pins: 100
Pads: 100
SMD: 6.4×6.4

STM32WB55VGYx

SYMFP—

MCU_ST_STM32WB

STMicroelectronics Arm Cortex-M4 MCU, 1024KB flash, 256KB RAM, 64 MHz, 1.71-3.6V, 72 GPIO, WLCSP100

Pins: 100
Pads: 100
SMD: 6.4×6.4

STM32WB55VYYx

SYMFP—

MCU_ST_STM32WB

STMicroelectronics Arm Cortex-M4 MCU, 640KB flash, 256KB RAM, 64 MHz, 1.71-3.6V, 72 GPIO, WLCSP100

Pins: 100
Pads: 100
SMD: 6.4×6.4

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception