Get Trace

ST_WLCSP-25_2.33x2.24mm_Layout5x5_P0.4mm

Package_CSP

ST WLCSP-25, ST Die ID 474, 2.33x2.24mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32h503eb.pdf#page=155

Footprint

25 pads
Footprint ST_WLCSP-25_2.33x2.24mm_Layout5x5_P0.4mm
Mount
Surface mount
Courtyard
4.34 × 4.24 mm
Pads
25
File
6 KB

3D model

STEP

Package_CSP_ST_WLCSP-25_2.33x2.24mm_Layout5x5_P0.4mm

2.33 × 2.24 × 0.59 mm

32 KB STEP

Library
Package_CSP_ST_WLCSP-25_2.33x2.24mm_Layout5x5
Model page
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Parts that use it

1 component in the catalog place this footprint

STM32H503EBYx

SYMFP3D

MCU_ST_STM32H5

STMicroelectronics Arm Cortex-M33 MCU, 128KB flash, 32KB RAM, 250 MHz, 19 GPIO, WLCSP25

Pins
25
Pads
25
SMD
4.3×4.2

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception