ST_WLCSP-49_3.3x3.38mm_Layout7x7_P0.4mm_Offcenter

Package_CSP

ST WLCSP-49, off-center ball grid, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119

Footprint

49 pads

Mount: Surface mount
Courtyard: 5.3 × 5.38 mm
Pads: 49
File: 9 KB

3D model

none

no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Parts that use it

1 component in the catalog place this footprint

STM32WB15CCYx

SYMFP—

MCU_ST_STM32WB

STMicroelectronics Arm Cortex-M4 MCU, 320KB flash, 48KB RAM, 64 MHz, 1.71-3.6V, 26 GPIO, WLCSP49

Pins: 49
Pads: 49
SMD: 5.3×5.4

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception