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ST_WLCSP-81_4.36x4.07mm_Layout9x9_P0.4mm

Package_CSP

ST WLCSP-81, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf

Footprint

81 pads
Footprint ST_WLCSP-81_4.36x4.07mm_Layout9x9_P0.4mm
Mount
Surface mount
Courtyard
6.36 × 6.08 mm
Pads
81
File
12 KB

3D model

none
no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Parts that use it

4 components in the catalog place this footprint

STM32L552MEYxP

SYMFP—

MCU_ST_STM32L5

STMicroelectronics Arm Cortex-M33 MCU, 512KB flash, 256KB RAM, 110 MHz, 1.71-3.6V, 61 GPIO, WLCSP81

Pins
81
Pads
81
SMD
6.4×6.1

STM32L552MEYxQ

SYMFP—

MCU_ST_STM32L5

STMicroelectronics Arm Cortex-M33 MCU, 512KB flash, 256KB RAM, 110 MHz, 1.71-3.6V, 58 GPIO, WLCSP81

Pins
81
Pads
81
SMD
6.4×6.1

STM32L562MEYxP

SYMFP—

MCU_ST_STM32L5

STMicroelectronics Arm Cortex-M33 MCU, 512KB flash, 256KB RAM, 110 MHz, 1.71-3.6V, 61 GPIO, WLCSP81

Pins
81
Pads
81
SMD
6.4×6.1

STM32L562MEYxQ

SYMFP—

MCU_ST_STM32L5

STMicroelectronics Arm Cortex-M33 MCU, 512KB flash, 256KB RAM, 110 MHz, 1.71-3.6V, 58 GPIO, WLCSP81

Pins
81
Pads
81
SMD
6.4×6.1

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception