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ST_WLCSP-99_4.42x3.77mm_Layout11x9_P0.35mm

Package_CSP

ST WLCSP-99, ST die ID 415, 4.42x3.77mm, 99 Ball, 11x9 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32l476vg.pdf

Footprint

99 pads
Footprint ST_WLCSP-99_4.42x3.77mm_Layout11x9_P0.35mm
Mount
Surface mount
Courtyard
6.42 × 5.78 mm
Pads
99
File
14 KB

3D model

none
no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

Parts that use it

1 component in the catalog place this footprint

STM32L476VGYxP

SYMFP—

MCU_ST_STM32L4

STMicroelectronics Arm Cortex-M4 MCU, 1024KB flash, 128KB RAM, 66 GPIO, WLCSP99

Pins
99
Pads
99
SMD
6.4×5.8

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception