WLCSP-6_1.46x1.1mm_Layout3x2_P0.4mm

Package_CSP

ams OSRAM 6-pin WLCSP / Wafer-Level Chip-Scale Package, 1.46x1.1mm, 6 Ball, 3x2 Layout, 0.4mm Pitch, https://look.ams-osram.com/m/19562c0de86ac97e/original/AS5510-DS000318.pdf#page=23

CSP
6
0.4
DSBGA-6
UFBGA-6

Footprint

6 pads

Mount: Surface mount
Courtyard: 3.46 × 3.1 mm
Pads: 6
File: 3 KB

3D model

STEP

Package_CSP_WLCSP-6_1.46x1.1mm_Layout3x2_P0.4mm

1.46 × 1.10 × 0.61 mm

15 KB STEP

Library: Package_CSP_WLCSP-6_1.46x1.1mm_Layout3x2
Model page: Open →

Parts that use it

1 component in the catalog place this footprint

AS5510-DWL

SYMFP3D

Sensor_Magnetic

Linear Hall Sensor, 10-bit resolution, I2C, WLCSP-6

Pins: 6
Pads: 6
SMD: 3.5×3.1

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception