CERDIP-14_W7.62mm_SideBrazed_LongPads_Socket

Package_DIP

14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Footprint

14 pads
Footprint CERDIP-14_W7.62mm_SideBrazed_LongPads_Socket
Mount
Through hole
Courtyard
10.66 × 19.68 mm
Pads
14
File
5 KB

3D model

none
no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

On real boards

The largest boards that carry it

DesignPartsNetsLayersBoardLicenceSource
H Mains Cutoff Circuit67472113.54 × 78.74 mmCC-BY-4.0Mounith-H/Mains-Cutoff-Circuit
EngrEDU Website2426272.34 × 39.6 mmCC-BY-4.0gfm16617/EngrEDU_Website

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception