CERDIP-18_W7.62mm_SideBrazed

Package_DIP

18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Footprint

18 pads
Footprint CERDIP-18_W7.62mm_SideBrazed
Mount
Through hole
Courtyard
9.73 × 23.36 mm
Pads
18
File
5 KB

3D model

none
no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

On real boards

The largest boards that carry it

DesignPartsNetsLayersBoardLicenceSource
EncoderPCB62130283 × 123.5 mmCC-BY-4.0CaelusRocketry/EncoderPCB

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception