CERDIP-20_W7.62mm_SideBrazed_Socket

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Footprint

20 pads
Footprint CERDIP-20_W7.62mm_SideBrazed_Socket
Mount
Through hole
Courtyard
10.66 × 26.02 mm
Pads
20
File
6 KB

3D model

none
no 3D model

This footprint names no 3D model, or names one the upstream package set never shipped. Nothing is shown rather than a model that 404s.

On real boards

The largest boards that carry it

DesignPartsNetsLayersBoardLicenceSource
ThylaThylakoid Hardware BOARD3831492120.02 × 170.05 mmCC-BY-4.0koki0517/ThylaThylakoid-Hardware

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception