DIP-12_W8.89mm_SMDSocket_LongPads

Package_DIP

12-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Footprint

12 pads
Footprint DIP-12_W8.89mm_SMDSocket_LongPads
Mount
Surface mount
Courtyard
12.5 × 15.86 mm
Pads
12
File
4 KB

3D model

STEP

Package_DIP_DIP-12_W8.89mm_SMDSocket

10.22 × 15.36 × 3.68 mm

349 KB STEP

Library
Package_DIP_DIP-12_W8.89mm
Model page
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On real boards

The largest boards that carry it

DesignPartsNetsLayersBoardLicenceSource
Elektronika 11927414.75 × 0 mmCC-BY-4.0BenjaminSoelberg/elektronika-1

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception