DIP-18_W8.89mm_SMDSocket_LongPads

Package_DIP

18-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Footprint

18 pads

Footprint DIP-18_W8.89mm_SMDSocket_LongPads

Mount: Surface mount
Courtyard: 12.5 × 23.48 mm
Pads: 18
File: 5 KB

3D model

STEP

Package_DIP_DIP-18_W8.89mm_SMDSocket

10.22 × 22.98 × 3.68 mm

507 KB STEP

Library: Package_DIP_DIP-18_W8.89mm
Model page: Open →

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception