DIP-28_W16.51mm_SMDSocket_LongPads

Package_DIP

28-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads

Footprint

28 pads

Footprint DIP-28_W16.51mm_SMDSocket_LongPads

Mount: Surface mount
Courtyard: 20.12 × 36.2 mm
Pads: 28
File: 6 KB

3D model

STEP

Package_DIP_DIP-28_W16.51mm_SMDSocket

17.84 × 35.68 × 3.68 mm

782 KB STEP

Library: Package_DIP_DIP-28_W16.51mm
Model page: Open →

On real boards

The largest boards that carry it

Design	Parts	Nets	Layers	Board	Licence	Source
Se C64 Eeprom	8	28	2	21.59 × 36.07 mm	CC-BY-4.0	relic-se/c64-eeprom ↗

Provenance

Source: kicad-footprints
Credit: KiCad Libraries Contributors
Licence: CC-BY-SA-4.0-with-KiCad-exception