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DIP-5-6_W7.62mm

Package_DIP

5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils)

Footprint

5 pads
Footprint DIP-5-6_W7.62mm
Mount
Through hole
Courtyard
9.8 × 8.15 mm
Pads
5
File
5 KB

3D model

STEP

Package_DIP_DIP-5-6_W7.62mm

7.87 × 7.05 × 6.98 mm

168 KB STEP

Library
Package_DIP_DIP-5-6
Model page
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Parts that use it

1 component in the catalog place this footprint

TLP3542

SYMFP3D

Relay_SolidState

Photo MOSFET optically coupled, ON 4A, 50mohm, OFF state 20V, Isolation 2500 VRMS, DIP-5-6

Pins
5
Pads
5
THT
9.8×8.2

On real boards

The largest boards that carry it

DesignPartsNetsLayersBoardLicenceSource
SE1222278.74 × 58.42 mmCC-BY-4.0martinhofigueiredo/SE ↗

Provenance

Credit
KiCad Libraries Contributors
Licence
CC-BY-SA-4.0-with-KiCad-exception